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TMS34020AGBL40

Texas Instruments

TMS34020AGBL40 by Texas Instruments

TMS34020AGBL40 by Texas Instruments is a 5V GPU with 145 terminals, operating at 40MHz. It has a max clock frequency of 40 MHz and supports up to 32 bits per pixel. Ideal for commercial graphics processing applications due to its CMOS technology and temperature range of 0-70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Vyrian

USA . 2,440 parts In-Stock

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Digiode

USA . 1,706 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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LWI Electronics Inc

India . 2 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 1 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 1 parts In-Stock

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A2Z Electronics, Inc.

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Sinequanon

UK . 1 parts In-Stock

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Andel Nordic

Denmark . 290 parts In-Stock

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$8.048

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$7.726

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$7.726

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$7.726

AZTECH Wire

Italy . 427 parts In-Stock

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$18.404

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Corohmni

South Africa . 2,898 parts In-Stock

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One Stop Electronics

USA . 1,583 parts In-Stock

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Parana Technologies

USA . 1,745 parts In-Stock

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$48.250

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DigiPath Technology Company

USA . 2,013 parts In-Stock

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$48.879

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IDEA Electronic Components Group

UK . 1,558 parts In-Stock

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$51.503

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$48.793

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ChromeModa Solutions

Germany . 1,370 parts In-Stock

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S.R.D Solutions

India . 240,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,514 parts In-Stock

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Corphita

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Kepictronics

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A-Plus Industry Inc.

USA . 2 parts In-Stock

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Overview

Enhance your graphics processing capabilities with the TMS34020AGBL40 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in the form of this graphics processor. Ideal for a wide range of applications, this GPU offers unparalleled performance and efficiency. Unlock new possibilities and elevate your projects with the value and benefits that the TMS34020AGBL40 brings to the table. Experience seamless graphics rendering and enhanced visual experiences like never before. Elevate your game with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination ensures durability and efficient heat dissipation, making the product reliable for long-term use.

Maximum Supply Voltage: 5.25 V

Allows for flexibility in power input, accommodating varying voltage levels without risking damage to the GPU.

Package Shape: SQUARE

The square shape provides a compact design, ideal for space-saving in electronic devices.

Maximum Operating Temperature: 70 °C

Can operate effectively even in high-temperature environments, ensuring stable performance under heavy workloads.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making the GPU energy-efficient and capable of handling demanding graphics tasks.

Technical Specifications

Graphics Processors (GPUs) TMS34020AGBL40 attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

JESD-30 Code:

S-CPGA-P145

Length:

40 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

145

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA145,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Maximum Supply Current:

260 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

40 mm

Peripheral IC Type:

Trade Compliance

TMS34020AGBL40 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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