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TMS34020AGBL32

Texas Instruments

TMS34020AGBL32 by Texas Instruments

TMS34020AGBL32 by Texas Instruments is a 32 MHz graphics processor with 145 terminals. It operates at 5V, suitable for commercial use with a temperature range of 0-70°C. The package is square in shape, measuring 40mm in width and length, featuring a grid array style for applications requiring high-speed graphics processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,511 parts In-Stock

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Digiode

USA . 3,389 parts In-Stock

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R&J Components

USA . 2 parts In-Stock

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J & M Industries LLC

USA . 2 parts In-Stock

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AZTECH Wire

Italy . 795 parts In-Stock

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$14.763

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One Stop Electronics

USA . 221 parts In-Stock

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$19.000

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Corohmni

South Africa . 2,595 parts In-Stock

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Parana Technologies

USA . 1,310 parts In-Stock

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$47.140

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DigiPath Technology Company

USA . 1,159 parts In-Stock

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$51.907

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$47.754

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ChromeModa Solutions

Germany . 6,302 parts In-Stock

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$52.966

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$43.432

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IDEA Electronic Components Group

UK . 514 parts In-Stock

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$52.966

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$50.318

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$47.669

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514

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A-Z Elektronik GmbH

Germany . 7,059 parts In-Stock

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Corphita

USA . 1,200 parts In-Stock

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Kepictronics

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A-Plus Industry Inc.

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Overview

Elevate your graphics processing capabilities with the TMS34020AGBL32 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. This graphics processor offers unparalleled performance and efficiency, making it ideal for a wide range of applications. Whether you're a gamer, designer, or engineer, this GPU will revolutionize your work and provide endless possibilities. Upgrade to the TMS34020AGBL32 today and experience the true power of cutting-edge technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination ensures durability and reliability, making the graphics processor suitable for long-term use.

Maximum Supply Voltage: 5.25 V

High maximum supply voltage allows for stable performance even under heavy workloads and demanding tasks.

Minimum Supply Voltage: 4.75 V

Low minimum supply voltage ensures energy efficiency and helps in reducing power consumption.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the graphics processor can withstand intense usage without overheating.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures that the graphics processor can function optimally even in cold environments.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast processing of graphics data, resulting in smooth and seamless visuals.

Technology: CMOS

CMOS technology provides excellent performance while consuming less power, making the graphics processor efficient and cost-effective.

Maximum Bits Per Pixel: 32

Supporting up to 32 bits per pixel ensures high color depth and accurate color representation in graphics output, enhancing visual quality.

Technical Specifications

Graphics Processors (GPUs) TMS34020AGBL32 attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

0

JESD-30 Code:

S-CPGA-P145

Length:

40 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

145

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA145,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Maximum Supply Current:

260 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

40 mm

Peripheral IC Type:

Trade Compliance

TMS34020AGBL32 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-431-8048, 5962014318048

NIIN

014318048

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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