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SMJ34020GBM28

Texas Instruments

SMJ34020GBM28 by Texas Instruments

Texas Instruments' SMJ34020GBM28 is a military-grade graphics processor with 144 terminals in a ceramic grid array package. Operating from -55°C to 125°C, it requires 5V supply and features CMOS technology. Ideal for applications requiring high-performance GPUs in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,638 parts In-Stock

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8,638

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Digiode

USA . 1,840 parts In-Stock

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1,840

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 249 parts In-Stock

1+ parts

$6.018

100+ parts

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249

$6.018

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One Stop Electronics

USA . 331 parts In-Stock

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$32.000

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331

$32.000

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Parana Technologies

USA . 929 parts In-Stock

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$51.967

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929

$51.967

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ChromeModa Solutions

Germany . 3,265 parts In-Stock

1+ parts

$58.390

100+ parts

$47.880

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3,265

$58.390

$47.880

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IDEA Electronic Components Group

UK . 531 parts In-Stock

1+ parts

$58.390

100+ parts

$55.470

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$52.551

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531

$58.390

$55.470

$52.551

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Corohmni

South Africa . 2,714 parts In-Stock

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$75.115

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2,714

$75.115

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Corphita

USA . 1,497 parts In-Stock

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DigiPath Technology Company

USA . 1,312 parts In-Stock

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$52.644

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1,312

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$52.644

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Overview

Unleash the power of cutting-edge technology with the SMJ34020GBM28 by Texas Instruments, a top-tier manufacturer known for its quality and reliability. As a Graphics Processor unit, this product offers unparalleled performance and efficiency in a wide range of applications. From gaming to data visualization, this GPU delivers exceptional value and benefits to customers looking for high-speed processing capabilities and seamless graphics rendering. Trust Texas Instruments to elevate your workflow with the SMJ34020GBM28 and experience the next level of innovation in graphics processing.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and reliability, making it ideal for high-performance applications such as graphics processors.

Power Supplies (V): 5

A power supply of 5V ensures compatibility with a wide range of systems and makes the product versatile for different hardware configurations.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this graphics processor can handle demanding tasks and maintain performance under high thermal loads.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high-speed performance, making this graphics processor energy-efficient and powerful.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures stable and reliable operation of the graphics processor, leading to consistent performance and reduced risk of voltage fluctuations.

Technical Specifications

Graphics Processors (GPUs) SMJ34020GBM28 attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-XPGA-P144

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA144,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Graphics Processors

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

SMJ34020GBM28 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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