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TMS34020GBL32

Texas Instruments

TMS34020GBL32 by Texas Instruments

TMS34020GBL32 by Texas Instruments is a 32 MHz graphics processor with 145 terminals, operating at 5V and drawing 260mA. It features a max supply voltage of 5.25V, suitable for commercial applications requiring high-resolution graphics processing in a compact square package.

Median Price

$45.810

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 2 parts In-Stock

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$45.810

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Vyrian

USA . 5,556 parts In-Stock

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Digiode

USA . 2,465 parts In-Stock

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MRC Electronics

USA . 34 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 14 parts In-Stock

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Holdelec - ElecDif-Pro

France . 14 parts In-Stock

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Zilex Electronics Inc.

Canada . 8 parts In-Stock

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J & M Industries LLC

USA . 5 parts In-Stock

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R&J Components

USA . 1 parts In-Stock

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North Shore Components

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Distributors (Availability)

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AZTECH Wire

Italy . 331 parts In-Stock

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$12.798

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One Stop Electronics

USA . 1,539 parts In-Stock

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$30.000

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Corohmni

South Africa . 480 parts In-Stock

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$45.424

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Parana Technologies

USA . 912 parts In-Stock

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$63.042

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$5,854.430

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$56.738

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DigiPath Technology Company

USA . 1,988 parts In-Stock

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$69.417

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$63.864

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IDEA Electronic Components Group

UK . 2,193 parts In-Stock

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$70.834

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$67.292

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$63.751

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ChromeModa Solutions

Germany . 557 parts In-Stock

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$70.834

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$58.084

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A-Z Elektronik GmbH

Germany . 5,258 parts In-Stock

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Corphita

USA . 977 parts In-Stock

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Perfect Parts

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Overview

Elevate your graphics processing capabilities with the TMS34020GBL32 by Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers top-of-the-line GPUs for a wide range of applications. The TMS34020GBL32 offers unparalleled value, providing customers with advanced performance and efficiency. Say goodbye to lagging graphics and hello to seamless visuals with this cutting-edge product. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material ensures durability and reliability for long-term use, making the GPU a good choice for high-performance computing tasks.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for efficient power delivery, enabling the GPU to handle complex graphics processing tasks with ease.

Package Shape: SQUARE

The square package shape helps in easy integration and space-saving design within the graphics processing unit, making it suitable for compact systems.

Power Supplies (V): 5

The 5 power supply voltage ensures stable and consistent power delivery to the GPU, resulting in reliable performance and optimal efficiency.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the GPU to operate under intense workload conditions without overheating, ensuring smooth and uninterrupted performance.

Technology: CMOS

The CMOS technology used in the GPU enhances power efficiency and reduces heat generation, making it an energy-efficient choice for graphics processing tasks.

Technical Specifications

Graphics Processors (GPUs) TMS34020GBL32 attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

0

JESD-30 Code:

S-CPGA-P145

Length:

40 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

145

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA145,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Maximum Supply Current:

260 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

40 mm

Peripheral IC Type:

Trade Compliance

TMS34020GBL32 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-431-8048, 5962014318048

NIIN

014318048

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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