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TMS34020APCM40

Texas Instruments

TMS34020APCM40 by Texas Instruments

TMS34020APCM40 by Texas Instruments is a 32-bit graphics processor with max clock freq of 40MHz. Operating temp range from 0-85°C, power supply of 5V, and package style flatpack. Ideal for high-performance graphic applications requiring fast processing speed and high resolution displays.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 6,500 parts In-Stock

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6,500

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Vyrian

USA . 6,294 parts In-Stock

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Digiode

USA . 4,025 parts In-Stock

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4,025

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LWI Electronics Inc

India . 14 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 850 parts In-Stock

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$16.000

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850

$16.000

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AZTECH Wire

Italy . 501 parts In-Stock

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$19.455

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501

$19.455

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Corohmni

South Africa . 518 parts In-Stock

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$31.416

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518

$31.416

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Parana Technologies

USA . 2,156 parts In-Stock

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$37.798

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$37.798

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DigiPath Technology Company

USA . 1,974 parts In-Stock

1+ parts

$41.621

100+ parts

$38.291

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1,974

$41.621

$38.291

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ChromeModa Solutions

Germany . 6,197 parts In-Stock

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$42.470

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$34.825

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$42.470

$34.825

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IDEA Electronic Components Group

UK . 605 parts In-Stock

1+ parts

$42.470

100+ parts

$40.346

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$38.223

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605

$42.470

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$38.223

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Component Stockers USA

USA . 526 parts In-Stock

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$99.990

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526

$99.990

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Corphita

USA . 2,267 parts In-Stock

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Assy Fe

Spain . 300 parts In-Stock

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Kepictronics

USA . 46 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of cutting-edge graphics processing with the TMS34020APCM40 by Texas Instruments. Designed for high-performance applications, this GPU offers unmatched quality and reliability from a trusted manufacturer. Ideal for a wide range of industries, this product delivers seamless graphics rendering and superior performance. Experience the value and benefits of this advanced technology, providing customers with a competitive edge in their projects. Elevate your visual experience with the TMS34020APCM40 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the GPU lightweight and durable, ideal for portable devices.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for efficient power utilization and performance.

Minimum Operating Temperature: 0 °C

The GPU can operate effectively in colder environments, ensuring reliable performance in various conditions.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency allows for fast processing and smooth graphics rendering.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation, making the GPU energy-efficient.

Technical Specifications

Graphics Processors (GPUs) TMS34020APCM40 attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.07 mm

Sub-Category:

Graphics Processors

Maximum Supply Current:

260 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

28 mm

Peripheral IC Type:

Trade Compliance

TMS34020APCM40 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-455-8029, 5962014558029

NIIN

014558029

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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