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EF9365C

STMicroelectronics

EF9365C by STMicroelectronics

EF9365C by STMicroelectronics is a ceramic, rectangular graphics processor designed for commercial use. It operates at a nominal voltage of 5V and features 40 terminals with a dual terminal position. Ideal for various graphics applications, it withstands temperatures from 0 °C to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,859 parts In-Stock

1+ parts

-

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4,859

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-

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Digiode

USA . 2,942 parts In-Stock

1+ parts

-

100+ parts

-

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2,942

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Anansix

USA . 567 parts In-Stock

1+ parts

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567

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 468 parts In-Stock

1+ parts

$0.809

100+ parts

-

1k+ parts

-

10k+ parts

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468

$0.809

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-

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Northwest PG Solutions

USA . 1,809 parts In-Stock

1+ parts

$0.890

100+ parts

-

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10k+ parts

-

1,809

$0.890

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-

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IDEA Electronic Components Group

UK . 2,169 parts In-Stock

1+ parts

$29.137

100+ parts

-

1k+ parts

$26.224

10k+ parts

-

2,169

$29.137

-

$26.224

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MKK Technologies

India . 802 parts In-Stock

1+ parts

$54.791

100+ parts

-

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802

$54.791

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-

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DigiPath Technology Company

USA . 802 parts In-Stock

1+ parts

$54.791

100+ parts

-

1k+ parts

-

10k+ parts

-

802

$54.791

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Corphita

USA . 2,460 parts In-Stock

1+ parts

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2,460

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Parana Technologies

USA . 1,215 parts In-Stock

1+ parts

-

100+ parts

$34.838

1k+ parts

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10k+ parts

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1,215

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$34.838

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Overview

Elevate your graphics applications with the EF9365C from STMicroelectronics, a leader in innovative technology. This high-quality graphics processor delivers exceptional performance and reliability, ideal for a range of applications from gaming to imaging. With robust ceramic packaging and commercial-grade temperature resilience, it ensures durability in diverse environments. Trust in STMicroelectronics for cutting-edge solutions that empower your projects and enhance user experiences.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent thermal conductivity and protection, making this GPU durable and reliable under various operating conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board, enabling better integration into various designs.

Power Supplies (V): 5

Operating at 5V ensures that this GPU is energy-efficient, suitable for lower-power applications while still delivering solid performance.

No. of Terminals: 40

A higher number of terminals allows for more complex connections, supporting advanced features and boosts performance capabilities.

Package Style (Meter): IN-LINE

The in-line package style simplifies the layout of PCB designs, contributing to easier assembly and improved signal integrity.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C provides a good balance between performance and heat management, making it suitable for various environments.

Minimum Operating Temperature: 0 °C

This new operating temperature range ensures that the GPU operates effectively even in cooler conditions, increasing its versatility.

Terminal Position: DUAL

Dual terminal positions enhance flexibility in circuit board design, allowing for optimized layout according to specific application needs.

Temperature Grade: COMMERCIAL

Designed for commercial grade use, this GPU is reliable and provides stable performance under standard operating conditions.

Peripheral IC Type: GRAPHICS PROCESSOR

As a dedicated graphics processor, it is tailored for high-performance rendering, making it an excellent choice for multimedia applications.

Technology: MOS

MOS technology contributes to high efficiency and low power consumption, which is essential for modern graphics applications and extended device life.

Terminal Form: THROUGH-HOLE

Through-hole terminal form offers enhanced mechanical stability and ease of soldering, making it ideal for durable connections in electronics.

Nominal Supply Voltage: 5 V

Providing a nominal supply voltage of 5V ensures compatibility with a wide range of devices, facilitating easy integration into existing systems.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this GPU can easily connect with standard PCB design practices, ensuring compatibility and ease of layout.

Technical Specifications

Graphics Processors (GPUs) EF9365C attributes and parameters. Explore more Graphics Processors (GPUs) devices from STMicroelectronics

Specs

JESD-30 Code:

R-XDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

EF9365C Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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