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5962-9162304MYA

Texas Instruments

5962-9162304MYA by Texas Instruments

The Texas Instruments 5962-9162304MYA is a military-grade graphics processor with 32-bit external data bus width, operating at up to 40 MHz. It features a ceramic, metal-sealed co-fired package body material and operates within a temperature range of -55°C to 125°C. Ideal for applications requiring high-performance graphics processing in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,428 parts In-Stock

1+ parts

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4,428

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Digiode

USA . 2,486 parts In-Stock

1+ parts

-

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2,486

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Electro Mavin

USA . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 762 parts In-Stock

1+ parts

$9.968

100+ parts

-

1k+ parts

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762

$9.968

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One Stop Electronics

USA . 183 parts In-Stock

1+ parts

$26.000

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183

$26.000

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Parana Technologies

USA . 763 parts In-Stock

1+ parts

$31.282

100+ parts

-

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$76.610

10k+ parts

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763

$31.282

-

$76.610

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ChromeModa Solutions

Germany . 5,658 parts In-Stock

1+ parts

$35.148

100+ parts

$28.821

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5,658

$35.148

$28.821

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IDEA Electronic Components Group

UK . 333 parts In-Stock

1+ parts

$35.148

100+ parts

$33.391

1k+ parts

$31.633

10k+ parts

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333

$35.148

$33.391

$31.633

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Native Components

USA . 681 parts In-Stock

1+ parts

$78.350

100+ parts

-

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$75.216

681

$78.350

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$75.216

Northwest PG Solutions

USA . 1,099 parts In-Stock

1+ parts

$86.185

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1,099

$86.185

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Corphita

USA . 1,782 parts In-Stock

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1,782

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Microchip USA

USA . 1,054 parts In-Stock

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1,054

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DigiPath Technology Company

USA . 635 parts In-Stock

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100+ parts

$31.689

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635

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$31.689

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Overview

Elevate your graphics processing capabilities with the 5962-9162304MYA by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge Graphics Processors (GPUs) that are ideal for a wide range of applications. Whether you're a gaming enthusiast, a graphic designer, or a tech-savvy professional, this product offers unparalleled value with its impressive performance, efficiency, and durability. Experience seamless graphics rendering, enhanced visual effects, and superior image quality with the 5962-9162304MYA. Upgrade your computing experience today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides durability and reliability, ensuring the GPU can withstand harsh operating conditions.

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

Allows for a higher supply voltage, which can result in increased performance and efficiency of the GPU.

Screening Level: MIL-STD-883

Meets military standards for quality and reliability, making it suitable for demanding applications.

Package Shape: SQUARE

Efficient use of space on the PCB, allowing for a compact design.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments without compromising performance or reliability.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed performance, making it an energy-efficient option.

Technical Specifications

Graphics Processors (GPUs) 5962-9162304MYA attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

JESD-30 Code:

S-CQFP-F132

JESD-609 Code:

e0

Length:

24.065 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

132

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

QFF

Package Equivalence Code:

QFL132,.95SQ,25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

3.3 mm

Sub-Category:

Graphics Processors

Maximum Supply Current:

280 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Width:

24.065 mm

Peripheral IC Type:

Trade Compliance

5962-9162304MYA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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