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SM34020AGBS40

Texas Instruments

SM34020AGBS40 by Texas Instruments

SM34020AGBS40 by Texas Instruments is a GPU with 32-bit external data bus, 5V nominal voltage, and 40MHz clock frequency. Ideal for industrial applications requiring high-performance graphics processing in a wide temperature range from -40 to 110°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,253 parts In-Stock

1+ parts

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7,253

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Digiode

USA . 2,978 parts In-Stock

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2,978

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 788 parts In-Stock

1+ parts

$10.000

100+ parts

-

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788

$10.000

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AZTECH Wire

Italy . 452 parts In-Stock

1+ parts

$18.987

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452

$18.987

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Parana Technologies

USA . 1,825 parts In-Stock

1+ parts

$36.287

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1,825

$36.287

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ChromeModa Solutions

Germany . 688 parts In-Stock

1+ parts

$40.772

100+ parts

$33.433

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688

$40.772

$33.433

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IDEA Electronic Components Group

UK . 439 parts In-Stock

1+ parts

$40.772

100+ parts

$38.733

1k+ parts

$36.695

10k+ parts

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439

$40.772

$38.733

$36.695

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Corohmni

South Africa . 547 parts In-Stock

1+ parts

$76.172

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547

$76.172

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Microchip USA

USA . 1,287 parts In-Stock

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1,287

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Corphita

USA . 1,068 parts In-Stock

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1,068

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DigiPath Technology Company

USA . 80 parts In-Stock

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$36.760

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80

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$36.760

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Overview

Unleash the power of cutting-edge graphics processing with the SM34020AGBS40 by Texas Instruments. Crafted with precision and expertise from a trusted manufacturer, this GPU offers unparalleled performance and reliability for a wide range of applications. Whether you're a gamer, designer, or tech enthusiast, this product delivers exceptional value with its advanced features and seamless functionality. Elevate your visual experience and bring your projects to life with the SM34020AGBS40.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials ensures durability and reliability of the GPU, making it suitable for industrial applications.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for stable performance and increased processing power for demanding graphics applications.

Package Shape: SQUARE

The square package shape provides efficient use of space and allows for optimal heat dissipation, leading to better performance and longevity of the GPU.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with most systems and minimizes the risk of damage due to excessive power.

Maximum Bits Per Pixel: 32

Supporting a maximum of 32 bits per pixel allows for high color depth and improved image quality, making it ideal for graphics-intensive tasks such as gaming or video editing.

Technical Specifications

Graphics Processors (GPUs) SM34020AGBS40 attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

JESD-30 Code:

S-CPGA-P145

Maximum Bits Per Pixel:

32

No. of Terminals:

145

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA145,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Maximum Supply Current:

280 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SM34020AGBS40 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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