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TMS34010FNL-40

Texas Instruments

TMS34010FNL-40 by Texas Instruments

TMS34010FNL-40 by Texas Instruments is a 68-terminal graphics processor with 5V supply voltage, operating b/w 0-70°C. It features CMOS technology, J bend terminals, and consumes up to 125mA current. Ideal for graphic processing applications in commercial-grade environments.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 6,728 parts In-Stock

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Digiode

USA . 4,700 parts In-Stock

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Nova Conductors

Japan . 19 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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AZTECH Wire

Italy . 863 parts In-Stock

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$14.805

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863

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Parana Technologies

USA . 2,179 parts In-Stock

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$19.730

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$19.707

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ChromeModa Solutions

Germany . 6,398 parts In-Stock

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$22.169

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$18.179

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IDEA Electronic Components Group

UK . 1,103 parts In-Stock

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$22.169

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$21.061

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$19.952

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Ampacity Inc.

Singapore . 599 parts In-Stock

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$25.000

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One Stop Electronics

USA . 1,396 parts In-Stock

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$31.000

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Corohmni

South Africa . 1,052 parts In-Stock

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Continental Prestige Electronics

USA . 4,750 parts In-Stock

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Argo Parts USA

USA . 4,353 parts In-Stock

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Perfect Parts

USA . 2,499 parts In-Stock

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Corphita

USA . 2,372 parts In-Stock

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DigiPath Technology Company

USA . 1,784 parts In-Stock

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$19.988

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Assy Fe

Spain . 521 parts In-Stock

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521

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unleash the power of cutting-edge graphics processing with the TMS34010FNL-40 by Texas Instruments. This high-quality product offers unmatched performance and reliability, making it the perfect choice for a wide range of applications in the gaming, medical imaging, and industrial automation industries. With its advanced technology and innovative design, this graphics processor delivers exceptional value and benefits to customers, ensuring seamless operation and stunning visual outcomes. Stay ahead of the curve with the TMS34010FNL-40 and experience superior graphics processing like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the GPU, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy installation and replacement of the GPU, making it more user-friendly.

Package Shape: SQUARE

The square shape of the package ensures a compact design, making it easier to integrate the GPU into various devices.

Power Supplies (V): 5

Operating at 5 volts provides a balance between power consumption and performance, making it suitable for a wide range of applications.

No. of Terminals: 68

The high number of terminals allows for efficient connectivity and data transfer, improving the overall performance of the GPU.

Terminal Position: QUAD

The quad terminal position ensures stable connections and enhances the reliability of the GPU during operation.

Temperature Grade: COMMERCIAL

Rated for commercial use, this GPU can operate within a wide temperature range, making it suitable for various environments.

Peripheral IC Type: GRAPHICS PROCESSOR

Designed specifically for graphics processing, this GPU delivers high-quality visuals and enhanced performance for gaming and multimedia applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making this GPU energy-efficient and reliable.

Technical Specifications

Graphics Processors (GPUs) TMS34010FNL-40 attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J68

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Maximum Supply Current:

125 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

TMS34010FNL-40 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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