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TMS34010-50FN

Texas Instruments

TMS34010-50FN by Texas Instruments

TMS34010-50FN by Texas Instruments is a GPU with 16-bit external data bus, operating at 50 MHz. It has a supply voltage range of 4.75V to 5.25V and operates in commercial temperature grade. This chip carrier package is suitable for graphics processing applications due to its high clock frequency and pixel depth capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,774 parts In-Stock

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Digiode

USA . 903 parts In-Stock

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903

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Distributors (Availability)

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One Stop Electronics

USA . 139 parts In-Stock

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$6.000

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139

$6.000

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AZTECH Wire

Italy . 490 parts In-Stock

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$18.785

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490

$18.785

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Parana Technologies

USA . 1,261 parts In-Stock

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$50.853

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$50.853

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ChromeModa Solutions

Germany . 5,555 parts In-Stock

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$57.138

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$46.853

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5,555

$57.138

$46.853

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IDEA Electronic Components Group

UK . 1,404 parts In-Stock

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$57.138

100+ parts

$54.281

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$51.424

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1,404

$57.138

$54.281

$51.424

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Corohmni

South Africa . 977 parts In-Stock

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$73.754

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977

$73.754

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DigiPath Technology Company

USA . 2,312 parts In-Stock

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$51.516

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Corphita

USA . 144 parts In-Stock

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Overview

Revolutionize your graphics processing with the TMS34010-50FN by Texas Instruments. Known for their top-quality products, Texas Instruments delivers superior performance and reliability. Ideal for applications such as gaming, digital signage, and image processing, this graphics processor offers unmatched value and benefits to customers. Upgrade your system with the TMS34010-50FN and experience a whole new level of graphics processing power.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the GPU, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures reliable and stable performance under different operating conditions.

Package Shape: SQUARE

The square package shape makes it easy to integrate the GPU into compact designs without wasting space.

No. of Terminals: 68

With a high number of terminals, this GPU can handle complex data processing tasks efficiently and effectively.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures energy efficiency and reduces power consumption during operation.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows the GPU to perform in harsh environments without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the GPU can operate reliably even in cold conditions.

Terminal Position: QUAD

The quad terminal position provides stability and secure connectivity to the circuit board, ensuring reliable data transfer.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making the GPU energy efficient and responsive.

Technical Specifications

Graphics Processors (GPUs) TMS34010-50FN attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

Length:

24.2062 mm

Maximum Bits Per Pixel:

16

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.5 mm

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.2062 mm

Peripheral IC Type:

Trade Compliance

TMS34010-50FN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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