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TMS34020-32

Texas Instruments

TMS34020-32 by Texas Instruments

TMS34020-32 by Texas Instruments is a GPU with 132 terminals, operating at 0-70°C. It has a supply voltage of 5V and current of 250mA. Used in graphics processing applications due to its CMOS technology and flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,360 parts In-Stock

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1,360

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Vyrian

USA . 1,041 parts In-Stock

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1,041

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,213 parts In-Stock

1+ parts

$6.000

100+ parts

-

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1,213

$6.000

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AZTECH Wire

Italy . 213 parts In-Stock

1+ parts

$17.097

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213

$17.097

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Parana Technologies

USA . 2,254 parts In-Stock

1+ parts

$35.885

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2,254

$35.885

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DigiPath Technology Company

USA . 272 parts In-Stock

1+ parts

$39.514

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272

$39.514

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ChromeModa Solutions

Germany . 3,693 parts In-Stock

1+ parts

$40.320

100+ parts

$33.062

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3,693

$40.320

$33.062

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IDEA Electronic Components Group

UK . 466 parts In-Stock

1+ parts

$40.320

100+ parts

$38.304

1k+ parts

$36.288

10k+ parts

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466

$40.320

$38.304

$36.288

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Corohmni

South Africa . 613 parts In-Stock

1+ parts

$46.553

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613

$46.553

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Corphita

USA . 3,201 parts In-Stock

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3,201

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Overview

Unleash the power of cutting-edge graphics processing with the TMS34020-32 by Texas Instruments. Designed to deliver unparalleled performance and reliability, this GPU is perfect for a wide range of applications. Whether you're creating stunning visual effects or immersive gaming experiences, this product offers unmatched value and benefits. Trust in Texas Instruments' reputation for excellence and elevate your projects to the next level with the TMS34020-32.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are cost-effective and lightweight, making the product suitable for portable devices or compact systems.

Surface Mount: YES

Surface mount technology saves space on the PCB and allows for efficient manufacturing processes.

Power Supplies (V): 5

Operating at a low voltage of 5V helps in reducing power consumption and heat generation, making it energy-efficient.

No. of Terminals: 132

Having a higher number of terminals allows for more connections and functionality within the GPU, increasing its processing capabilities.

Package Style: FLATPACK

Flatpack packages are compact and easy to mount, making them suitable for space-constrained applications.

Operating Temperature: 0-70 °C

The wide operating temperature range ensures reliable performance in various environmental conditions.

Terminal Position: QUAD

Quad terminal arrangement allows for efficient signal routing and connectivity, improving overall performance.

Temperature Grade: COMMERCIAL

Commercial grade components are suitable for standard consumer electronics applications, offering a balance between cost and performance.

Peripheral IC Type: GRAPHICS PROCESSOR

Being a graphics processor, the GPU is optimized for handling complex visual data, making it ideal for graphics-intensive tasks such as gaming or video editing.

Technology: CMOS

CMOS technology offers low power consumption, fast operation speeds, and high noise immunity, enhancing the overall efficiency of the GPU.

Terminal Form: FLAT

Flat terminals provide a secure and reliable connection, ensuring stable performance under varying conditions.

Maximum Supply Current: 250 mA

The maximum supply current of 250mA ensures that the GPU operates within safe limits, preventing overheating and damage to other components.

Nominal Supply Voltage: 5V

A nominal supply voltage of 5V is common and easily available, making it convenient for integration into different systems.

Technical Specifications

Graphics Processors (GPUs) TMS34020-32 attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

No. of Terminals:

132

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFF

Package Equivalence Code:

QFL132(UNSPEC)

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Maximum Supply Current:

250 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

TMS34020-32 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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