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SMJ34010-50FD

Texas Instruments

SMJ34010-50FD by Texas Instruments

SMJ34010-50FD by Texas Instruments is a military-grade graphics processor with 68 terminals, operating b/w -55°C to 125°C. It requires 5V supply voltage and draws a max current of 150mA. Ideal for applications requiring high-performance GPUs in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,295 parts In-Stock

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4,295

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Digiode

USA . 1,206 parts In-Stock

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1,206

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 944 parts In-Stock

1+ parts

$4.000

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944

$4.000

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AZTECH Wire

Italy . 772 parts In-Stock

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$5.552

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772

$5.552

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Corohmni

South Africa . 273 parts In-Stock

1+ parts

$58.717

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273

$58.717

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Parana Technologies

USA . 786 parts In-Stock

1+ parts

$63.642

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786

$63.642

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DigiPath Technology Company

USA . 1,128 parts In-Stock

1+ parts

$70.078

100+ parts

$64.472

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1,128

$70.078

$64.472

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IDEA Electronic Components Group

UK . 1,194 parts In-Stock

1+ parts

$71.508

100+ parts

$67.933

1k+ parts

$64.357

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1,194

$71.508

$67.933

$64.357

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ChromeModa Solutions

Germany . 5 parts In-Stock

1+ parts

$71.508

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$58.637

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5

$71.508

$58.637

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Corphita

USA . 4,220 parts In-Stock

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4,220

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Overview

Unlock the power of cutting-edge graphics processing with the SMJ34010-50FD by Texas Instruments. Crafted with precision using top-quality materials and advanced technology, this GPU offers unrivaled performance and reliability. Ideal for a wide range of applications, from gaming to professional design, this product delivers exceptional value and benefits to customers. Elevate your visual experience with the SMJ34010-50FD and experience the difference that superior quality and innovation can make in your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high thermal conductivity and is resistant to high temperatures, making it ideal for efficient heat dissipation in a high-performance graphics processor.

Surface Mount: YES

Surface mount technology allows for compact and efficient placement of components on a PCB, saving space and improving overall design efficiency.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of systems and power sources, increasing the versatility of this graphics processor.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this graphics processor can handle demanding tasks and maintain stability even under heavy workload conditions.

Temperature Grade: MILITARY

Meeting military-grade standards ensures durability, reliability, and performance in harsh environments, making this graphics processor suitable for critical applications where reliability is paramount.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption, high speed, and reliability, making this graphics processor energy-efficient and responsive for demanding graphics processing tasks.

Technical Specifications

Graphics Processors (GPUs) SMJ34010-50FD attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N68

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC68,.95SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Graphics Processors

Maximum Supply Current:

150 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

SMJ34010-50FD Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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