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SMJ34010-50GBM

Texas Instruments

SMJ34010-50GBM by Texas Instruments

SMJ34010-50GBM by Texas Instruments is a military-grade GPU with 16-bit external data bus, 50 MHz clock frequency, and CMOS technology. Ideal for applications requiring high-performance graphics processing in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,652 parts In-Stock

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Digiode

USA . 1,594 parts In-Stock

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1,594

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One Stop Electronics

USA . 757 parts In-Stock

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$1.000

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757

$1.000

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Corohmni

South Africa . 3,010 parts In-Stock

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$15.738

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3,010

$15.738

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AZTECH Wire

Italy . 417 parts In-Stock

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$18.991

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417

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Parana Technologies

USA . 1,806 parts In-Stock

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$74.044

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1,806

$74.044

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DigiPath Technology Company

USA . 1,493 parts In-Stock

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$81.531

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$75.009

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1,493

$81.531

$75.009

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IDEA Electronic Components Group

UK . 1,021 parts In-Stock

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$83.195

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$79.035

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$74.876

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1,021

$83.195

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$74.876

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ChromeModa Solutions

Germany . 349 parts In-Stock

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$83.195

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$68.220

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349

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Corphita

USA . 3,718 parts In-Stock

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Kepictronics

USA . 47 parts In-Stock

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Overview

Unleash the power of cutting-edge graphics processing with the SMJ34010-50GBM by Texas Instruments. Crafted with precision using high-quality ceramic and metal-sealed cofired materials, this GPU offers unparalleled performance in military-grade applications. With a maximum clock frequency of 50 MHz and a nominal supply voltage of 5 V, this powerhouse delivers seamless graphics rendering at lightning speed. Elevate your projects to new heights with the SMJ34010-50GBM and experience the ultimate in graphics processing technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides good thermal conductivity and durability, ensuring reliable performance even under demanding conditions.

Maximum Supply Voltage: 5.5 V

Allows for a higher maximum voltage input, providing flexibility and compatibility with a wide range of systems.

Screening Level: MIL-PRF-38535

Ensures that the product meets rigorous military standards for reliability and performance, making it suitable for mission-critical applications.

Package Shape: SQUARE

The square shape allows for efficient use of space and easy integration into various device designs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this graphics processor can handle intensive tasks and maintain stable performance under heavy workloads.

Technology: CMOS

Complementary metal-oxide-semiconductor (CMOS) technology offers low power consumption and high speed, making this graphics processor energy-efficient and fast.

Technical Specifications

Graphics Processors (GPUs) SMJ34010-50GBM attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CPGA-P68

Length:

24.13 mm

Maximum Bits Per Pixel:

16

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

3.58 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

SMJ34010-50GBM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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