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5962-9162303MYX

Texas Instruments

5962-9162303MYX by Texas Instruments

The Texas Instruments 5962-9162303MYX is a military-grade graphics processor with CMOS technology. It operates b/w -55 to 125 °C and supports a 32 MHz clock frequency. With a 32-bit external data bus width, it is ideal for high-performance graphic processing applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,224 parts In-Stock

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3,224

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Digiode

USA . 3,082 parts In-Stock

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3,082

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,735 parts In-Stock

1+ parts

$2.585

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1,735

$2.585

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AZTECH Wire

Italy . 770 parts In-Stock

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$12.899

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770

$12.899

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Parana Technologies

USA . 61 parts In-Stock

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$23.921

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$24.563

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61

$23.921

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$24.563

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One Stop Electronics

USA . 244 parts In-Stock

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$26.000

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244

$26.000

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ChromeModa Solutions

Germany . 6,957 parts In-Stock

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$26.878

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$22.040

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6,957

$26.878

$22.040

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IDEA Electronic Components Group

UK . 837 parts In-Stock

1+ parts

$26.878

100+ parts

$25.534

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$24.190

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837

$26.878

$25.534

$24.190

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Corohmni

South Africa . 5,115 parts In-Stock

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$46.879

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$46.879

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DigiPath Technology Company

USA . 2,144 parts In-Stock

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$24.233

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2,144

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$24.233

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Native Components

USA . 968 parts In-Stock

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$2.279

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968

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$2.279

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Corphita

USA . 578 parts In-Stock

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578

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Overview

Unlock the power of cutting-edge graphics processing technology with the 5962-9162303MYX by Texas Instruments. Crafted with precision and expertise, this GPU offers unparalleled performance in a compact and durable package. Ideal for military-grade applications, this graphics processor delivers seamless visuals with a wide external data bus width and maximum clock frequency of 32 MHz. Elevate your projects with the reliability and innovation that only Texas Instruments can provide. Experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The combination of ceramic and metal-sealed cofired materials provides durability and reliability, making this product suitable for rugged environments.

Surface Mount: YES

Being surface mountable allows for easy installation on printed circuit boards, speeding up manufacturing processes.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can operate efficiently and reliably within a wide range of power sources.

Screening Level: MIL-STD-883 Class B

Meeting MIL-STD-883 Class B standards ensures that this product has undergone rigorous testing, resulting in high quality and reliability.

Package Shape: SQUARE

The square shape allows for efficient use of space on a PCB, making it ideal for compact electronic designs.

No. of Terminals: 132

Having a high number of terminals enables this GPU to handle complex data processing tasks efficiently.

Package Style (Meter): FLATPACK

The flatpack design simplifies the manufacturing process and allows for better thermal dissipation, enhancing the overall performance of the GPU.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this GPU can withstand extreme conditions without compromising its performance.

Technology: CMOS

Using CMOS technology ensures low power consumption and high switching speeds, making this GPU energy-efficient and fast.

Technical Specifications

Graphics Processors (GPUs) 5962-9162303MYX attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

JESD-30 Code:

S-CQFP-F132

Length:

24.065 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

132

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

QFF

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.065 mm

Peripheral IC Type:

Trade Compliance

5962-9162303MYX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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