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5962-9072701MYX

Texas Instruments

5962-9072701MYX by Texas Instruments

The Texas Instruments 5962-9072701MYX is a military-grade graphics processor with CMOS technology. It operates b/w -55 to 125 °C, supports a 16-bit external data bus, and has a max clock frequency of 40 MHz. Ideal for applications requiring high-performance graphics processing in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,566 parts In-Stock

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6,566

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Digiode

USA . 4,955 parts In-Stock

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4,955

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Distributors (Availability)

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One Stop Electronics

USA . 966 parts In-Stock

1+ parts

$10.000

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966

$10.000

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AZTECH Wire

Italy . 479 parts In-Stock

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$11.585

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479

$11.585

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Parana Technologies

USA . 1,122 parts In-Stock

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$32.497

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$106.300

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1,122

$32.497

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$106.300

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DigiPath Technology Company

USA . 1,942 parts In-Stock

1+ parts

$35.784

100+ parts

$32.921

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1,942

$35.784

$32.921

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ChromeModa Solutions

Germany . 4,874 parts In-Stock

1+ parts

$36.514

100+ parts

$29.941

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4,874

$36.514

$29.941

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IDEA Electronic Components Group

UK . 787 parts In-Stock

1+ parts

$36.514

100+ parts

$34.688

1k+ parts

$32.863

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787

$36.514

$34.688

$32.863

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Native Components

USA . 225 parts In-Stock

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$69.330

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$66.557

225

$69.330

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$66.557

Northwest PG Solutions

USA . 93 parts In-Stock

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$76.263

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93

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Corphita

USA . 1,466 parts In-Stock

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Overview

Unleash the power of cutting-edge graphics processing with the 5962-9072701MYX by Texas Instruments. Crafted with precision and expertise, this GPU offers unparalleled performance and reliability for a wide range of applications. Whether you're a gaming enthusiast seeking seamless visuals or a professional designer pushing the boundaries of creativity, this product delivers exceptional value, benefits, and advantages. Elevate your experience and unlock limitless possibilities with Texas Instruments' top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent heat dissipation, ensuring optimal performance and reliability even under high operating temperatures.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this GPU can handle higher power consumption levels and provide efficient processing capabilities.

Screening Level: MIL-STD-883 Class B

Meeting the MIL-STD-883 Class B screening level ensures high reliability and performance consistency, making it suitable for demanding military applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the GPU to function reliably even in harsh environmental conditions.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency of 40 MHz enables fast processing speeds and smooth graphics rendering for high-performance applications.

Technical Specifications

Graphics Processors (GPUs) 5962-9072701MYX attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-N68

Maximum Bits Per Pixel:

16

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

5962-9072701MYX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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