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5962-9162302MYA

Texas Instruments

5962-9162302MYA by Texas Instruments

The Texas Instruments 5962-9162302MYA is a military-grade graphics processor with CMOS technology. It operates b/w -55°C to 125°C, with supply voltage ranging from 4.75V to 5.25V. Featuring a 32-bit external data bus width, it is ideal for high-performance applications in aerospace and defense industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,734 parts In-Stock

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Digiode

USA . 3,608 parts In-Stock

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3,608

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Distributors (Availability)

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AZTECH Wire

Italy . 480 parts In-Stock

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$6.336

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480

$6.336

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Native Components

USA . 913 parts In-Stock

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$9.560

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913

$9.560

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Northwest PG Solutions

USA . 688 parts In-Stock

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$10.516

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$9.464

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688

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One Stop Electronics

USA . 1,087 parts In-Stock

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$27.000

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1,087

$27.000

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Parana Technologies

USA . 1,983 parts In-Stock

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$76.231

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1,983

$76.231

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DigiPath Technology Company

USA . 1,871 parts In-Stock

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$83.940

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$77.225

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$83.940

$77.225

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ChromeModa Solutions

Germany . 5,116 parts In-Stock

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$85.653

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$70.235

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$85.653

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IDEA Electronic Components Group

UK . 2,315 parts In-Stock

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$85.653

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$81.370

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$77.088

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2,315

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$77.088

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Corphita

USA . 787 parts In-Stock

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Overview

Elevate your graphics processing capabilities with the 5962-9162302MYA by Texas Instruments. Crafted with precision and expertise, this military-grade graphics processor offers unparalleled performance and reliability. Ideal for a wide range of applications, this CMOS technology GPU is designed to deliver exceptional graphics quality and speed. Experience seamless visuals and enhanced efficiency with Texas Instruments' innovative solution. Upgrade your system today and unlock a whole new world of possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and can withstand high temperatures, making it ideal for long-term use in demanding environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space in the overall design.

Maximum Supply Voltage: 5.25 V

Higher supply voltage allows for better performance and efficiency in handling complex graphics processing tasks.

Screening Level: MIL-STD-883

Compliance with military screening standards ensures reliability and quality in extreme conditions, making it suitable for critical applications.

Package Shape: RECTANGULAR

Rectangular shape provides efficient use of space on circuit boards and allows for easy integration into various systems.

No. of Terminals: 132

Large number of terminals allow for a wide range of connectivity options and support for complex graphics processing requirements.

Package Style (Meter): FLATPACK

Flatpack style offers a compact form factor, reducing the overall size of the GPU and enabling installation in tight spaces.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage ensures compatibility with a variety of power sources and improves energy efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in harsh environments without risking overheating or damage.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in extreme cold conditions, making it suitable for a variety of environments.

Terminal Position: QUAD

Quad terminal position offers efficient signal routing and connectivity options, enhancing the overall performance of the GPU.

External Data Bus Width: 32

Wider data bus width allows for faster data transfer and processing speeds, improving overall graphics performance.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliability and robustness in challenging conditions, making it suitable for defense and aerospace applications.

Peripheral IC Type: GRAPHICS PROCESSOR

Specialized graphics processor IC enhances graphics performance and enables high-quality visuals in gaming, design, and multimedia applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making it an efficient and reliable choice for graphics processing.

Terminal Form: FLAT

Flat terminal form allows for easy soldering and secure connection, ensuring stable operation and longevity of the GPU.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent and reliable performance of the GPU, reducing the risk of voltage fluctuations affecting operation.

Technical Specifications

Graphics Processors (GPUs) 5962-9162302MYA attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

External Data Bus Width:

32

JESD-30 Code:

R-CQFP-F132

No. of Terminals:

132

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

QFF

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

5962-9162302MYA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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