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5962-9072702MYA

Texas Instruments

5962-9072702MYA by Texas Instruments

The Texas Instruments 5962-9072702MYA is a military-grade graphics processor with 16-bit external data bus width and 50 MHz max clock frequency. It operates b/w -55 to 125 °C, with a supply voltage range of 4.5V to 5.5V. This GPU is ideal for high-performance applications requiring robust processing capabilities in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,596 parts In-Stock

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7,596

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Digiode

USA . 1,634 parts In-Stock

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1,634

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Distributors (Availability)

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Native Components

USA . 82 parts In-Stock

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$1.148

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82

$1.148

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Northwest PG Solutions

USA . 376 parts In-Stock

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$1.263

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376

$1.263

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One Stop Electronics

USA . 734 parts In-Stock

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$5.000

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734

$5.000

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AZTECH Wire

Italy . 611 parts In-Stock

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$9.785

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611

$9.785

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Parana Technologies

USA . 786 parts In-Stock

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$16.922

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$17.157

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786

$16.922

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$17.157

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ChromeModa Solutions

Germany . 4,101 parts In-Stock

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$19.014

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$15.591

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4,101

$19.014

$15.591

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IDEA Electronic Components Group

UK . 711 parts In-Stock

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$19.014

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$18.063

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$17.113

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711

$19.014

$18.063

$17.113

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Corohmni

South Africa . 901 parts In-Stock

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$65.750

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901

$65.750

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Corphita

USA . 4,601 parts In-Stock

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4,601

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Glotronic Ltd.

UK . 3,000 parts In-Stock

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DigiPath Technology Company

USA . 669 parts In-Stock

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$17.143

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669

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Overview

Unleash the power of cutting-edge graphics processing with the 5962-9072702MYA by Texas Instruments. Crafted with precision and expertise, this GPU is designed to elevate your visual experience to new heights. Whether you're a gamer, designer, or content creator, this chip carrier package delivers unparalleled performance and reliability. With a maximum clock frequency of 50 MHz and a temperature grade of MILITARY, it's built to withstand the most demanding tasks. Upgrade your device today with the Texas Instruments 5962-9072702MYA and witness the difference for yourself.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials ensures reliability and durability, making this GPU suitable for rugged environments.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power requirements, making it compatible with a wide range of systems and configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for easy integration into circuit boards, saving space and streamlining the overall design.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this GPU is capable of performing reliably even in challenging thermal conditions.

Peripheral IC Type: GRAPHICS PROCESSOR

As a dedicated graphics processor, this GPU is optimized for graphics-intensive tasks, providing superior visual performance in applications such as gaming or image processing.

Technical Specifications

Graphics Processors (GPUs) 5962-9072702MYA attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-N68

Maximum Bits Per Pixel:

16

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC68,.95SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Graphics Processors

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

5962-9072702MYA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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