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SMJ34010-40FD

Texas Instruments

SMJ34010-40FD by Texas Instruments

SMJ34010-40FD by Texas Instruments is a military-grade graphics processor with 68 terminals, operating at -55 to 125°C. It requires 5V supply voltage and draws a max of 125mA current. Ideal for applications requiring high-performance GPUs in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,819 parts In-Stock

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Digiode

USA . 4,246 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 837 parts In-Stock

1+ parts

$13.671

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837

$13.671

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One Stop Electronics

USA . 240 parts In-Stock

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$14.000

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240

$14.000

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Corohmni

South Africa . 207 parts In-Stock

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$21.033

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207

$21.033

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Parana Technologies

USA . 232 parts In-Stock

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$41.295

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232

$41.295

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DigiPath Technology Company

USA . 2,235 parts In-Stock

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$45.471

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$41.833

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2,235

$45.471

$41.833

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ChromeModa Solutions

Germany . 1,162 parts In-Stock

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$46.399

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$38.047

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$46.399

$38.047

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IDEA Electronic Components Group

UK . 670 parts In-Stock

1+ parts

$46.399

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$44.079

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$41.759

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670

$46.399

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$41.759

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Corphita

USA . 2,346 parts In-Stock

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Overview

Unleash the power of cutting-edge graphics processing with the Texas Instruments SMJ34010-40FD. As a leader in semiconductor technology, Texas Instruments delivers top-quality GPUs that are perfect for a wide range of applications. From gaming to industrial design, this chip carrier package offers unmatched performance and reliability. With a focus on innovation and precision, Texas Instruments provides customers with the value and benefits they need to stay ahead of the competition. Upgrade your system today with the SMJ34010-40FD and experience the difference Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity and excellent durability, ensuring reliable performance even under high operating temperatures.

Surface Mount: YES

Surface mount technology allows for efficient and compact circuit board design, saving space and enabling easier assembly.

Screening Level: 38535Q/M;38534H;883B

High screening level ensures the GPU meets stringent quality standards and reliability requirements for military and aerospace applications.

Package Shape: SQUARE

Square package shape provides a uniform and compact form factor, facilitating easy integration into electronic devices.

Power Supplies (V): 5

Operating at 5V makes the GPU compatible with standard power sources and simplifies the overall power system design.

No. of Terminals: 68

Having 68 terminals allows for multiple connections and interfaces, enabling versatile functionality and connectivity options.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers enhanced protection and thermal performance, vital for high power graphics processing applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the GPU can withstand high thermal loads and operate reliably in harsh environments.

Minimum Operating Temperature: -55 °C

Operating down to -55°C ensures functionality in extreme cold conditions, making the GPU suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections, ensuring consistent performance and reliability in demanding environments.

Temperature Grade: MILITARY

Military-grade temperature specifications guarantee ruggedness and resilience, making the GPU ideal for mission-critical and defense applications.

Peripheral IC Type: GRAPHICS PROCESSOR

Being a graphics processor, this IC is specialized for high-performance graphics rendering and processing, delivering exceptional visual quality and performance.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making the GPU energy-efficient and capable of handling demanding graphics tasks.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and provides improved electrical performance, ensuring long-term reliability and sustainability.

Maximum Supply Current: 125 mA

With a maximum supply current of 125mA, the GPU operates efficiently within specified power limits, enhancing overall system stability and performance.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V simplifies power management and compatibility with standard power sources, making integration hassle-free.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27mm allows for precise and reliable connections, minimizing signal interference and ensuring consistent performance.

Technical Specifications

Graphics Processors (GPUs) SMJ34010-40FD attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N68

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC68,.95SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Graphics Processors

Maximum Supply Current:

125 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

SMJ34010-40FD Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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