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SMJ34010-40GBM

Texas Instruments

SMJ34010-40GBM by Texas Instruments

SMJ34010-40GBM by Texas Instruments is a military-grade GPU with 16-bit external data bus, operating at max 40 MHz. It has a package style of grid array and can handle temperatures from -55 to 125 °C. Ideal for high-performance graphics applications in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,363 parts In-Stock

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7,363

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Digiode

USA . 4,087 parts In-Stock

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4,087

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Distributors (Availability)

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One Stop Electronics

USA . 1,289 parts In-Stock

1+ parts

$1.000

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1,289

$1.000

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AZTECH Wire

Italy . 617 parts In-Stock

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$18.529

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617

$18.529

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Parana Technologies

USA . 1,096 parts In-Stock

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$58.050

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1,096

$58.050

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Corohmni

South Africa . 577 parts In-Stock

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$61.704

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577

$61.704

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DigiPath Technology Company

USA . 1,984 parts In-Stock

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$63.920

100+ parts

$58.807

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1,984

$63.920

$58.807

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ChromeModa Solutions

Germany . 3,357 parts In-Stock

1+ parts

$65.225

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$53.484

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3,357

$65.225

$53.484

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IDEA Electronic Components Group

UK . 1,110 parts In-Stock

1+ parts

$65.225

100+ parts

$61.964

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$58.702

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1,110

$65.225

$61.964

$58.702

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Corphita

USA . 334 parts In-Stock

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334

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Overview

Unleash the power of cutting-edge graphics processing with the SMJ34010-40GBM by Texas Instruments. Crafted with precision and expertise, this GPU offers unparalleled performance and reliability for a wide range of applications. From immersive gaming experiences to seamless multimedia presentations, this product delivers superior quality and efficiency. Elevate your projects with the value, benefits, and advantages that only Texas Instruments can provide. Experience the difference with the SMJ34010-40GBM today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides durability and reliability, ensuring the GPU is able to withstand harsh operating conditions.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5V allows for stable and efficient performance of the GPU, providing reliable power delivery for graphics processing.

Package Shape: SQUARE

The square package shape offers a compact and space-efficient design, making it easier to integrate the GPU into various systems or devices.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the GPU can operate in high-temperature environments without compromising performance or reliability.

Technology: CMOS

The CMOS technology used in the GPU allows for low power consumption, enabling efficient graphics processing while minimizing energy usage.

Technical Specifications

Graphics Processors (GPUs) SMJ34010-40GBM attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CPGA-P68

Length:

24.13 mm

Maximum Bits Per Pixel:

16

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

3.58 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

SMJ34010-40GBM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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