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5962-9162304MXA

Texas Instruments

5962-9162304MXA by Texas Instruments

The Texas Instruments 5962-9162304MXA is a military-grade graphics processor with 32-bit external data bus width and max clock frequency of 40 MHz. It operates in temperatures ranging from -55°C to 125°C, making it suitable for rugged environments requiring high-performance graphics processing capabilities. The package style is grid array with 145 terminals, ideal for applications where reliability and durability are essential.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,795 parts In-Stock

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7,795

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Digiode

USA . 441 parts In-Stock

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441

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Distributors (Availability)

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AZTECH Wire

Italy . 688 parts In-Stock

1+ parts

$11.807

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688

$11.807

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One Stop Electronics

USA . 1,398 parts In-Stock

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$15.000

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1,398

$15.000

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Parana Technologies

USA . 1,316 parts In-Stock

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$74.942

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$6,959.461

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$67.447

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1,316

$74.942

$6,959.461

$67.447

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DigiPath Technology Company

USA . 506 parts In-Stock

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$82.520

100+ parts

$75.918

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506

$82.520

$75.918

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ChromeModa Solutions

Germany . 5,438 parts In-Stock

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$84.204

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$69.047

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5,438

$84.204

$69.047

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IDEA Electronic Components Group

UK . 815 parts In-Stock

1+ parts

$84.204

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$79.994

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$75.784

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815

$84.204

$79.994

$75.784

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Native Components

USA . 258 parts In-Stock

1+ parts

$505.802

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$495.686

1k+ parts

$490.628

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$485.570

258

$505.802

$495.686

$490.628

$485.570

Northwest PG Solutions

USA . 1,909 parts In-Stock

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$556.382

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Corphita

USA . 3,098 parts In-Stock

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3,098

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Microchip USA

USA . 2,713 parts In-Stock

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Overview

Unleash the power of cutting-edge graphics processing with the 5962-9162304MXA by Texas Instruments. Crafted with precision and expertise, this GPU is designed to elevate your visual experience to new heights. Whether you're a gaming enthusiast, a creative professional, or a tech-savvy individual, this product delivers unparalleled performance and reliability. With Texas Instruments' reputation for excellence in semiconductor manufacturing, rest assured that you are investing in a top-tier product that will exceed your expectations. Upgrade your system today and unlock a world of possibilities with the 5962-9162304MXA.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This high-quality package body material ensures durability and reliability for the graphics processor, making it suitable for long-term use in various environments.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for stable and efficient performance of the graphics processor, ensuring optimal functionality under heavy workloads.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 screening level indicates that the graphics processor has undergone rigorous testing and meets stringent military standards for performance and reliability.

Package Shape: SQUARE

The square package shape allows for efficient integration and installation of the graphics processor in various systems and devices, optimizing space utilization.

Power Supplies (V): 5

The 5V power supply enables compatibility with standard power sources, making the graphics processor easy to integrate into existing systems.

No. of Terminals: 145

The high number of terminals provides ample connectivity options for the graphics processor, allowing for versatile usage in a wide range of applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient thermal dissipation and signal routing for the graphics processor, ensuring optimal performance under heavy workloads.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage enables energy-efficient operation of the graphics processor, reducing power consumption and overall running costs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance allows the graphics processor to withstand extreme heat conditions, ensuring reliable performance in challenging environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature tolerance enables the graphics processor to function reliably in cold climates or refrigerated environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish enhances the electrical conductivity and corrosion resistance of the graphics processor, ensuring long-term reliability and performance.

Terminal Position: PERPENDICULAR

The perpendicular terminal position facilitates easy installation and secure connection of the graphics processor, reducing the risk of connectivity issues and ensuring stable operation.

Maximum Seated Height: 5.21 mm

The low maximum seated height allows for compact installation of the graphics processor in space-constrained environments, maximizing system integration flexibility.

Width: 39.75 mm

The standard width of the graphics processor offers compatibility with various system configurations and form factors, ensuring easy integration and installation.

External Data Bus Width: 32

The wide external data bus width of 32 bits enables high-speed data transfer and processing capabilities for the graphics processor, enhancing overall performance.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40 MHz ensures fast and efficient processing of data by the graphics processor, resulting in smooth graphics rendering and high performance.

Length: 39.75 mm

The standard length of the graphics processor allows for easy integration and installation in various system configurations, ensuring compatibility with different setups.

Temperature Grade: MILITARY

The military-grade temperature tolerance ensures that the graphics processor can operate reliably in harsh environmental conditions and mission-critical applications, making it a robust and dependable choice.

Peripheral IC Type: GRAPHICS PROCESSOR

The graphics processor is specifically designed to handle complex graphics processing tasks efficiently, making it an ideal choice for applications that require high-quality visual rendering.

Technology: CMOS

The CMOS technology used in the graphics processor enables low power consumption, high speed, and reliable performance, making it an energy-efficient and high-performance solution.

Terminal Form: PIN/PEG

The pin/peg terminal form provides a secure and stable connection for the graphics processor, ensuring reliable data transfer and communication between the device and the system.

Maximum Supply Current: 280 mA

The maximum supply current of 280 mA indicates the power consumption requirements of the graphics processor, enabling efficient power management and optimization for various applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures stable and reliable power delivery to the graphics processor, allowing for consistent performance and optimal functionality.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm enables easy connectivity and installation of the graphics processor in various systems and devices, ensuring compatibility and ease of integration.

Maximum Bits Per Pixel: 32

The maximum bits per pixel of 32 allows for high-resolution and color depth support by the graphics processor, enabling superior visual quality and rendering capabilities for enhanced user experience.

Technical Specifications

Graphics Processors (GPUs) 5962-9162304MXA attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

JESD-30 Code:

S-CPGA-P145

JESD-609 Code:

e0

Length:

39.75 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

145

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA144,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.21 mm

Sub-Category:

Graphics Processors

Maximum Supply Current:

280 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

39.75 mm

Peripheral IC Type:

Trade Compliance

5962-9162304MXA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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