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OMAP3515DCBBR

Texas Instruments

OMAP3515DCBBR by Texas Instruments

OMAP3515DCBBR by Texas Instruments is a Graphics Processor with 515 terminals in a square package. It operates b/w 0-70°C, suitable for commercial use. This CMOS technology GPU has power supplies of 1.1V, 1.2V, and 1.8V, making it ideal for graphic-intensive applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,988 parts In-Stock

1+ parts

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4,988

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Vyrian

USA . 4,829 parts In-Stock

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4,829

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 587 parts In-Stock

1+ parts

$14.904

100+ parts

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587

$14.904

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One Stop Electronics

USA . 1,637 parts In-Stock

1+ parts

$35.000

100+ parts

-

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1,637

$35.000

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Corohmni

South Africa . 3,239 parts In-Stock

1+ parts

$47.172

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3,239

$47.172

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Parana Technologies

USA . 2,227 parts In-Stock

1+ parts

$66.390

100+ parts

$6,165.359

1k+ parts

$59.751

10k+ parts

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2,227

$66.390

$6,165.359

$59.751

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DigiPath Technology Company

USA . 1,462 parts In-Stock

1+ parts

$73.104

100+ parts

$67.256

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1,462

$73.104

$67.256

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ChromeModa Solutions

Germany . 3,488 parts In-Stock

1+ parts

$74.596

100+ parts

$61.169

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3,488

$74.596

$61.169

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IDEA Electronic Components Group

UK . 948 parts In-Stock

1+ parts

$74.596

100+ parts

$70.866

1k+ parts

$67.136

10k+ parts

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948

$74.596

$70.866

$67.136

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Corphita

USA . 1,233 parts In-Stock

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1,233

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Overview

Experience cutting-edge graphics processing power with the OMAP3515DCBBR by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments delivers unparalleled performance and reliability in the GPU category. This versatile product offers a wide range of applications, from gaming to multimedia content creation. With its advanced technology and innovative design, the OMAP3515DCBBR provides customers with exceptional value, efficiency, and seamless user experience. Elevate your projects to the next level with this game-changing graphics processor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package, making it suitable for portable devices and reducing the risk of damage during handling or installation.

Surface Mount: YES

Being surface-mountable allows for easier and more efficient assembly on printed circuit boards, enabling quick and seamless integration into various electronic devices.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on the PCB, making it more compact and efficient in terms of design layout.

Power Supplies (V): 1.1, 1.2, 1.8, 1.8/3

This wide range of power supply options ensures compatibility with different voltage requirements, offering flexibility in system designs and power management.

No. of Terminals: 515

Having a large number of terminals allows for more connections and interfaces, enabling the GPU to handle complex graphics processing tasks efficiently.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style facilitate high-density mounting, enhancing performance and allowing for greater processing capabilities in a compact form factor.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this GPU can operate reliably under normal conditions, ensuring stability and performance in various environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C allows the GPU to function effectively even in colder environments, providing consistent performance across different temperature ranges.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process and ensures secure connections, reducing the risk of signal interference or loss during operation.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades makes this GPU suitable for standard commercial applications, offering reliability and performance for a wide range of industries and uses.

Peripheral IC Type: GRAPHICS PROCESSOR

As a dedicated graphics processor, this GPU is specifically designed for handling graphics-intensive tasks, making it an ideal choice for gaming, multimedia, and other visual computing applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high speed, and reliable performance, making this GPU energy-efficient and highly responsive for demanding graphics processing tasks.

Terminal Form: BALL

The ball terminal form enhances solder joint reliability and signal integrity, ensuring stable connections and optimal performance for the GPU in various operating conditions.

Terminal Pitch: 0.4 mm

With a small terminal pitch of 0.4 mm, this GPU enables high-density mounting and fine-pitch connections, allowing for compact design layouts and efficient signal transmission for superior graphics processing capabilities.

Technical Specifications

Graphics Processors (GPUs) OMAP3515DCBBR attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B515

No. of Terminals:

515

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.1,1.2,1.8,1.8/3

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

OMAP3515DCBBR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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