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5962-9162304MXX

Texas Instruments

5962-9162304MXX by Texas Instruments

The Texas Instruments 5962-9162304MXX is a military-grade graphics processor with 32-bit external data bus width and 40 MHz max clock frequency. It operates b/w -55 to 125 °C, suitable for high-performance applications in harsh environments like aerospace and defense systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,228 parts In-Stock

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5,228

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Digiode

USA . 2,300 parts In-Stock

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2,300

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Distributors (Availability)

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AZTECH Wire

Italy . 769 parts In-Stock

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$18.125

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769

$18.125

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One Stop Electronics

USA . 449 parts In-Stock

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$22.000

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449

$22.000

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Native Components

USA . 64 parts In-Stock

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$28.140

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64

$28.140

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Northwest PG Solutions

USA . 1,583 parts In-Stock

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$30.954

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$27.859

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1,583

$30.954

$27.859

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Parana Technologies

USA . 410 parts In-Stock

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$53.715

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410

$53.715

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DigiPath Technology Company

USA . 2,071 parts In-Stock

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$59.147

100+ parts

$54.415

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2,071

$59.147

$54.415

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ChromeModa Solutions

Germany . 3,182 parts In-Stock

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$60.354

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$49.490

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$60.354

$49.490

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IDEA Electronic Components Group

UK . 1,015 parts In-Stock

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$60.354

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$57.336

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$54.319

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1,015

$60.354

$57.336

$54.319

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Corohmni

South Africa . 208 parts In-Stock

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$76.759

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208

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Corphita

USA . 3,796 parts In-Stock

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Overview

Upgrade your graphics processing capabilities with the 5962-9162304MXX by Texas Instruments. Crafted with precision and expertise, this GPU offers unmatched performance and reliability for a variety of military-grade applications. With a maximum clock frequency of 40 MHz and a wide external data bus width of 32 bits per pixel, this graphics processor delivers seamless operation even in extreme temperatures. Trust in Texas Instruments to provide the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability for long-term use.

Maximum Supply Voltage: 5.25 V

Operating at a higher maximum supply voltage allows for efficient performance under varying load conditions.

Screening Level: MIL-STD-883 Class B

Compliance with MIL-STD-883 Class B standards guarantees high-quality and robust performance in demanding environments.

Package Shape: SQUARE

The square package shape offers efficient use of space and easy integration into various electronic systems.

No. of Terminals: 145

Having a higher number of terminals enables connectivity with multiple external components for enhanced functionality.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this GPU can withstand extreme cold conditions without compromising performance.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency ensures fast processing speeds and smooth graphics rendering for demanding applications.

Technology: CMOS

The use of CMOS technology offers power efficiency and high performance for optimized graphics processing tasks.

Terminal Form: PIN/PEG

The PIN/PEG terminal form provides secure connections and ease of installation in compatible systems.

Maximum Bits Per Pixel: 32

Support for up to 32 bits per pixel ensures high color depth and image quality for immersive visual experiences.

Technical Specifications

Graphics Processors (GPUs) 5962-9162304MXX attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

JESD-30 Code:

S-CPGA-P145

Length:

39.751 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

145

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Qualified

Screening Level:

MIL-STD-883 Class B

Maximum Seated Height:

5.21 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

39.751 mm

Peripheral IC Type:

Trade Compliance

5962-9162304MXX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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