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5962-9072702MYX

Texas Instruments

5962-9072702MYX by Texas Instruments

5962-9072702MYX by Texas Instruments is a military-grade graphics processor with CMOS technology. It operates b/w -55 to 125 °C, has a max clock frequency of 50 MHz, and supports up to 16 bits per pixel. Ideal for applications requiring high-performance GPUs in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,666 parts In-Stock

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Digiode

USA . 730 parts In-Stock

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730

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AZTECH Wire

Italy . 472 parts In-Stock

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$19.805

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Parana Technologies

USA . 812 parts In-Stock

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$23.485

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DigiPath Technology Company

USA . 1,509 parts In-Stock

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$25.131

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$23.121

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ChromeModa Solutions

Germany . 4,936 parts In-Stock

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$25.644

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$21.028

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IDEA Electronic Components Group

UK . 681 parts In-Stock

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$25.644

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$24.362

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$23.080

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One Stop Electronics

USA . 658 parts In-Stock

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$34.000

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Corphita

USA . 1,310 parts In-Stock

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Native Components

USA . 163 parts In-Stock

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Northwest PG Solutions

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Overview

Revolutionize your graphics processing with the 5962-9072702MYX by Texas Instruments. Crafted with precision and expertise, this GPU boasts unparalleled performance and reliability. Ideal for military-grade applications, this chip carrier package offers a wide operating temperature range and high clock frequency. Upgrade your systems with this ceramic, metal-sealed co-fired powerhouse that delivers crystal-clear graphics and seamless operation. Trust in Texas Instruments to bring you cutting-edge technology that exceeds expectations. Elevate your graphics experience today with the 5962-9072702MYX.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides good thermal conductivity and electrical insulation, making it suitable for high-performance applications like graphics processors.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for better performance and stability in demanding graphics processing tasks.

Screening Level: MIL-STD-883 Class B

Compliance with MIL-STD-883 Class B ensures high reliability and quality, important for military-grade applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this graphics processor can withstand intense usage and maintain performance under stress.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency allows for fast processing and smooth graphics rendering, essential for gaming, design, and other intensive tasks.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making this graphics processor efficient and effective for various applications.

Technical Specifications

Graphics Processors (GPUs) 5962-9072702MYX attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-N68

Maximum Bits Per Pixel:

16

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

5962-9072702MYX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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