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OMAP3515DCBCR

Texas Instruments

OMAP3515DCBCR by Texas Instruments

OMAP3515DCBCR by Texas Instruments is a Graphics Processor with 515 terminals in a square package. It operates b/w 0-70°C, suitable for commercial use. The CMOS technology and fine pitch grid array make it ideal for graphics processing applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,752 parts In-Stock

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Digiode

USA . 4,713 parts In-Stock

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4,713

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Distributors (Availability)

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One Stop Electronics

USA . 150 parts In-Stock

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$2.000

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150

$2.000

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AZTECH Wire

Italy . 462 parts In-Stock

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$14.866

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462

$14.866

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Corohmni

South Africa . 102 parts In-Stock

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$18.777

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102

$18.777

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Parana Technologies

USA . 23 parts In-Stock

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$74.232

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23

$74.232

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ChromeModa Solutions

Germany . 1,253 parts In-Stock

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$83.407

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$68.394

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1,253

$83.407

$68.394

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IDEA Electronic Components Group

UK . 1,022 parts In-Stock

1+ parts

$83.407

100+ parts

$79.237

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$75.066

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1,022

$83.407

$79.237

$75.066

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DigiPath Technology Company

USA . 1,666 parts In-Stock

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$75.200

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$75.200

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Corphita

USA . 159 parts In-Stock

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159

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Overview

Get ready to elevate your graphics experience with the OMAP3515DCBCR by Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge technology in the form of this graphics processor. Whether you're looking to enhance gaming performance, streamline video editing, or accelerate machine learning applications, this GPU is designed to exceed your expectations. With its advanced features and reliable performance, the OMAP3515DCBCR offers exceptional value and benefits to customers seeking top-tier graphics processing power. Elevate your visual experience today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability while keeping the weight of the GPU low, making it suitable for various devices and applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving time and improving the overall manufacturing process.

Power Supplies (V): 1.1,1.2,1.8,1.8/3

The wide range of power supply options ensures compatibility with various systems, giving flexibility in design and application.

No. of Terminals: 515

With a high number of terminals, this GPU can handle a large amount of data and communication, enhancing its processing capabilities.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the GPU to perform reliably even in demanding environments without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature means the GPU can function effectively in a wide range of temperature conditions, ensuring consistent performance.

Terminal Position: BOTTOM

The terminal position at the bottom provides a stable connection and helps in efficient heat dissipation, improving overall performance and lifespan.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures that this GPU is suitable for standard commercial applications, offering reliability and stability.

Peripheral IC Type: GRAPHICS PROCESSOR

Designed specifically as a graphics processor, this GPU is optimized for graphical tasks, ensuring high-quality video output and smooth graphics.

Technology: CMOS

Using CMOS technology offers low power consumption, high speed, and compatibility with a wide range of devices, making this GPU efficient and versatile.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection, improving signal transmission and overall performance of the GPU.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density packaging, saving space on circuit boards and enabling compact and powerful GPU designs.

Technical Specifications

Graphics Processors (GPUs) OMAP3515DCBCR attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B515

No. of Terminals:

515

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,26X26,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.1,1.2,1.8,1.8/3

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

OMAP3515DCBCR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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