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MCIMX6U5DVM10ABR

NXP Semiconductors

MCIMX6U5DVM10ABR by NXP Semiconductors

GRAPHICS PROCESSOR; No. of Terminals: 624; Moisture Sensitivity Level (MSL): 3; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Terminal Finish: TIN SILVER COPPER;

Median Price

$40.964

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

MCIMX6U5DVM10ABR by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 10,000 parts In-Stock

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$40.964

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Flip Electronics (Authorized)

USA . 5,735 parts In-Stock

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5,735

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Flip Electronics

USA . 5,564 parts In-Stock

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Vyrian

USA . 3,504 parts In-Stock

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Anansix

USA . 798 parts In-Stock

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Digiode

USA . 550 parts In-Stock

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550

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Distributors (Availability)

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One Stop Electronics

USA . 5,313 parts In-Stock

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$4.000

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Corohmni

South Africa . 1,969 parts In-Stock

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$37.346

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Microchip USA

USA . 1,896 parts In-Stock

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$83.100

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Component Stockers USA

USA . 232 parts In-Stock

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$480.100

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Lixinc

USA . 14,870 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,600 parts In-Stock

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UNI Independent Distributors

Spain . 3,064 parts In-Stock

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Corphita

USA . 2,000 parts In-Stock

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Perfect Parts

USA . 1,680 parts In-Stock

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Technical Specifications

Graphics Processors (GPUs) MCIMX6U5DVM10ABR attributes and parameters. Explore more Graphics Processors (GPUs) devices from NXP Semiconductors

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA624,25X25,32

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05/1.5

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Maximum Supply Current:

2200 mA

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

MCIMX6U5DVM10ABR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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