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XOMAP3530DCCUS

Texas Instruments

XOMAP3530DCCUS by Texas Instruments

XOMAP3530DCCUS by Texas Instruments is a Graphics Processor with 423 terminals in a GRID ARRAY package. It operates at 1.1V, 1.8V, and 3.3V power supplies using CMOS technology. Ideal for applications requiring high-performance graphics processing in compact devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,345 parts In-Stock

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8,345

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Digiode

USA . 2,992 parts In-Stock

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2,992

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Distributors (Availability)

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AZTECH Wire

Italy . 227 parts In-Stock

1+ parts

$15.245

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227

$15.245

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One Stop Electronics

USA . 849 parts In-Stock

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$32.000

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849

$32.000

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Corohmni

South Africa . 40 parts In-Stock

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$35.557

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40

$35.557

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Parana Technologies

USA . 586 parts In-Stock

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$48.371

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586

$48.371

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DigiPath Technology Company

USA . 672 parts In-Stock

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$53.262

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$49.001

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672

$53.262

$49.001

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IDEA Electronic Components Group

UK . 552 parts In-Stock

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$54.349

100+ parts

$51.632

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$48.914

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552

$54.349

$51.632

$48.914

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ChromeModa Solutions

Germany . 122 parts In-Stock

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$54.349

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$44.566

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$44.566

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Corphita

USA . 4,981 parts In-Stock

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Overview

Unleash the power of cutting-edge graphics processing with the XOMAP3530DCCUS by Texas Instruments. Renowned for its superior quality and reliability, Texas Instruments leads the industry in providing top-notch graphics processors for a wide range of applications. Elevate your project with this high-performance GPU, offering unparalleled value and benefits. Experience seamless operation, stunning visuals, and unmatched efficiency with the XOMAP3530DCCUS, setting new standards in graphic processing technology. Enhance your projects with the best in the business – choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures the package is lightweight and durable, making it ideal for portable devices where weight and reliability are important factors.

Surface Mount: YES

Being surface mount compatible allows for easier and more efficient assembly of the GPU onto circuit boards, reducing production time and costs.

Package Shape: SQUARE

The square package shape helps in optimizing space on the circuit board, allowing for a more compact design and efficient use of available area.

Power Supplies (V): 1.1,1.8,3.3

Supporting multiple power supply voltages gives flexibility in designing and integrating the GPU into various devices with different power requirements.

No. of Terminals: 423

The high number of terminals allows for a complex and feature-rich GPU design, enabling advanced graphics processing capabilities for high-performance applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style offers high density and efficient signal routing, enhancing the performance and data transfer capabilities of the GPU.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates better heat dissipation and easier connection to the circuit board, improving overall reliability and thermal management.

Peripheral IC Type: GRAPHICS PROCESSOR

Being a dedicated graphics processor, the GPU is highly optimized for rendering images and videos, providing excellent visual quality and performance for graphic-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making the GPU energy-efficient, fast, and dependable for demanding computing tasks.

Terminal Form: BALL

The ball terminal form allows for better electrical connections, thermal conductivity, and mechanical strength, ensuring stable performance and durability of the GPU in various operating conditions.

Terminal Pitch: 0.635 mm

The small terminal pitch provides high-density interconnects, enabling more terminals in a limited space, which increases functionality and processing power of the GPU.

Technical Specifications

Graphics Processors (GPUs) XOMAP3530DCCUS attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B423

No. of Terminals:

423

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

XOMAP3530DCCUS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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