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TMS34010-60FNR

Texas Instruments

TMS34010-60FNR by Texas Instruments

TMS34010-60FNR by Texas Instruments is a 16-bit graphics processor with max clock freq of 60MHz. It operates b/w 0-70°C, has supply voltage range of 4.75-5.25V, and consumes up to 175mA. Ideal for graphic processing applications requiring high-speed performance in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,413 parts In-Stock

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Digiode

USA . 2,681 parts In-Stock

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2,681

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Distributors (Availability)

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One Stop Electronics

USA . 637 parts In-Stock

1+ parts

$11.000

100+ parts

-

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637

$11.000

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AZTECH Wire

Italy . 227 parts In-Stock

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$14.781

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227

$14.781

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Corohmni

South Africa . 74 parts In-Stock

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$38.304

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74

$38.304

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Parana Technologies

USA . 1,711 parts In-Stock

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$53.920

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1,711

$53.920

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DigiPath Technology Company

USA . 5 parts In-Stock

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$59.372

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5

$59.372

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ChromeModa Solutions

Germany . 3,393 parts In-Stock

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$60.584

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$49.679

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3,393

$60.584

$49.679

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IDEA Electronic Components Group

UK . 2,125 parts In-Stock

1+ parts

$60.584

100+ parts

$57.555

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$54.526

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2,125

$60.584

$57.555

$54.526

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Corphita

USA . 4,035 parts In-Stock

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4,035

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Overview

Unlock the power of stunning graphics with the TMS34010-60FNR by Texas Instruments. This high-quality graphics processor offers unparalleled performance and reliability, backed by the trusted name of Texas Instruments. Ideal for a wide range of applications, this GPU delivers exceptional value and benefits to customers looking to enhance their visual experiences. Elevate your projects with the TMS34010-60FNR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is commonly used in electronic components for its durability and resistance to environmental factors, making this GPU a reliable choice.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for stable performance under varying power conditions, ensuring consistent operation of the graphics processor.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this GPU can handle cold environments without compromising its performance, making it versatile for various applications.

Maximum Clock Frequency: 60 MHz

A high maximum clock frequency of 60 MHz indicates that this GPU can process data at a fast rate, enabling smooth graphics rendering and high performance in demanding tasks.

External Data Bus Width: 16

With an external data bus width of 16 bits, this GPU can efficiently handle data transfer between components, enhancing overall system speed and responsiveness.

Technical Specifications

Graphics Processors (GPUs) TMS34010-60FNR attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

Length:

24.2062 mm

Maximum Bits Per Pixel:

16

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.5 mm

Maximum Supply Current:

175 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.2062 mm

Peripheral IC Type:

Trade Compliance

TMS34010-60FNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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