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TMS34020APCML32

Texas Instruments

TMS34020APCML32 by Texas Instruments

TMS34020APCML32 by Texas Instruments is a 32 MHz graphics processor with 144 terminals, operating at 0-70°C. It has a supply voltage range of 4.75-5.25 V and supports up to 32 bits per pixel. Ideal for applications requiring high-performance graphics processing in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,064 parts In-Stock

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Digiode

USA . 231 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 645 parts In-Stock

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$9.368

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$9.368

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One Stop Electronics

USA . 159 parts In-Stock

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$10.000

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Parana Technologies

USA . 35 parts In-Stock

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$46.734

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Corohmni

South Africa . 4,909 parts In-Stock

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$47.392

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DigiPath Technology Company

USA . 1,786 parts In-Stock

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$51.460

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ChromeModa Solutions

Germany . 6,958 parts In-Stock

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$52.510

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$43.058

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IDEA Electronic Components Group

UK . 1,610 parts In-Stock

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$52.510

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$49.884

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$47.259

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Corphita

USA . 2,701 parts In-Stock

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Overview

Experience unparalleled graphics performance with the TMS34020APCML32 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line Graphics Processors (GPUs) that are perfect for a wide range of applications. Whether you're a gamer, designer, or engineer, this product offers exceptional value, benefits, and advantages that will take your projects to the next level. Upgrade to the TMS34020APCML32 and unlock endless possibilities in visual computing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to damage, ensuring the longevity of the product.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, making installation simpler and more efficient.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage provides flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: SQUARE

Square shape allows for efficient use of space and easy placement within electronic devices.

No. of Terminals: 144

Higher number of terminals enable greater connectivity and functionality within the graphics processor.

Package Style (Meter): FLATPACK

Flatpack style offers a compact design and efficient heat dissipation, contributing to overall system performance.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage ensures compatibility with a variety of power sources and operational stability.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows the graphics processor to function reliably even under demanding conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the graphics processor can operate effectively in a wide range of environments.

Terminal Position: QUAD

Quad terminal position enables efficient connection to the system and facilitates data transfer within the graphics processor.

Maximum Seated Height: 4.07 mm

Low maximum seated height allows for space-saving installation and greater flexibility in system design.

Width: 28 mm

Optimal width dimension provides a balance between compact size and efficient performance in the graphics processor.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency enables fast processing speeds and smooth operation of the graphics processor.

Length: 28 mm

Balanced length dimension contributes to space-saving installation and compatibility with various system configurations.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard environmental conditions, making it suitable for a wide range of applications.

Peripheral IC Type: GRAPHICS PROCESSOR

Specialized graphics processor IC enhances graphical performance and ensures high-quality image rendering in multimedia applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the graphics processor energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides a stable and secure connection, enhancing the durability and reliability of the graphics processor.

Maximum Supply Current: 260 mA

Moderate maximum supply current ensures efficient power usage and prevents overheating of the graphics processor during operation.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the graphics processor.

Terminal Pitch: 0.65 mm

Narrow terminal pitch enables high-density mounting and efficient data transfer within the graphics processor, enhancing overall system performance.

Maximum Bits Per Pixel: 32

High maximum bits per pixel value supports rich color depth and vibrant graphics display, enhancing the visual experience in multimedia applications.

Technical Specifications

Graphics Processors (GPUs) TMS34020APCML32 attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

4.07 mm

Maximum Supply Current:

260 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

TMS34020APCML32 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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