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SM34020AHTM40

Texas Instruments

SM34020AHTM40 by Texas Instruments

SM34020AHTM40 by Texas Instruments is a military-grade graphics processor with 32-bit external data bus width and 40 MHz clock frequency. It operates b/w -55 to 125 °C, suitable for high-performance applications requiring fast image processing in harsh environments. The package style is flatpack, with a ceramic, metal-sealed co-fired body material.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,117 parts In-Stock

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4,117

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Vyrian

USA . 3,635 parts In-Stock

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3,635

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 852 parts In-Stock

1+ parts

$10.917

100+ parts

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852

$10.917

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Corohmni

South Africa . 489 parts In-Stock

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$16.208

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489

$16.208

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One Stop Electronics

USA . 1,452 parts In-Stock

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$30.000

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1,452

$30.000

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Parana Technologies

USA . 132 parts In-Stock

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$40.246

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132

$40.246

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IDEA Electronic Components Group

UK . 1,515 parts In-Stock

1+ parts

$45.220

100+ parts

$42.959

1k+ parts

$40.698

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1,515

$45.220

$42.959

$40.698

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ChromeModa Solutions

Germany . 152 parts In-Stock

1+ parts

$45.220

100+ parts

$37.080

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152

$45.220

$37.080

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$46.294

100+ parts

$42.128

1k+ parts

$37.961

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500

$46.294

$42.128

$37.961

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Corphita

USA . 4,858 parts In-Stock

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4,858

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DigiPath Technology Company

USA . 72 parts In-Stock

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$40.770

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72

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$40.770

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Overview

Enhance your graphics processing capabilities with the SM34020AHTM40 by Texas Instruments, a top-quality GPU designed for maximum performance and reliability. With a MILITARY-grade temperature grade and a maximum clock frequency of 40 MHz, this graphics processor is perfect for demanding applications in aerospace, defense, and industrial sectors. Experience seamless graphics rendering with the advanced CMOS technology and enjoy the benefits of its compact square package shape and surface mount design. Trust Texas Instruments for cutting-edge technology and unleash the full potential of your graphics applications with the SM34020AHTM40.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides good heat dissipation and durability, ensuring stable performance of the graphics processor.

Surface Mount: YES

The surface mount design makes it easier to integrate the graphics processor into various electronic devices without the need for through-hole mounting.

Maximum Supply Voltage: 5.25 V

With a higher maximum supply voltage, the graphics processor can handle power fluctuations better and operate reliably.

Package Shape: SQUARE

The square shape allows for efficient use of space within electronic devices, making it suitable for compact designs.

No. of Terminals: 132

Having a higher number of terminals enables the graphics processor to connect to multiple components, improving overall functionality.

Package Style (Meter): FLATPACK

The flatpack style offers a low profile, making the graphics processor suitable for slim devices where space is limited.

Minimum Operating Temperature: -55 °C

The wide temperature range allows the graphics processor to function in extreme cold environments without compromising performance.

Maximum Clock Frequency: 40 MHz

The high clock frequency enables the graphics processor to process data quickly and deliver smooth graphics performance.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the graphics processor efficient and fast in operation.

Technical Specifications

Graphics Processors (GPUs) SM34020AHTM40 attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

JESD-30 Code:

S-CQFP-F132

Length:

24.065 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

132

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

QFF

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Width:

24.065 mm

Peripheral IC Type:

Trade Compliance

SM34020AHTM40 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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