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SM34020AGBM32

Texas Instruments

SM34020AGBM32 by Texas Instruments

SM34020AGBM32 by Texas Instruments is a military-grade graphics processor with 32-bit external data bus width and 32 MHz max clock frequency. It operates b/w -55 to 125 °C, suitable for high-performance applications requiring precise graphics rendering in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,280 parts In-Stock

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Digiode

USA . 592 parts In-Stock

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592

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One Stop Electronics

USA . 139 parts In-Stock

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$16.000

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139

$16.000

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AZTECH Wire

Italy . 625 parts In-Stock

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$19.029

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625

$19.029

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Corohmni

South Africa . 5,091 parts In-Stock

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$38.831

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$38.831

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Parana Technologies

USA . 2,369 parts In-Stock

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$47.662

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2,369

$47.662

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ChromeModa Solutions

Germany . 3,283 parts In-Stock

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$53.553

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$43.913

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3,283

$53.553

$43.913

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IDEA Electronic Components Group

UK . 389 parts In-Stock

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$53.553

100+ parts

$50.875

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$48.198

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389

$53.553

$50.875

$48.198

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Microchip USA

USA . 3,393 parts In-Stock

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Corphita

USA . 2,648 parts In-Stock

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2,648

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DigiPath Technology Company

USA . 247 parts In-Stock

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$48.283

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Kepictronics

USA . 120 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the SM34020AGBM32 by Texas Instruments, a leading manufacturer of top-notch Graphics Processors. This cutting-edge GPU boasts a military-grade temperature grade and a maximum clock frequency of 32 MHz, making it ideal for a wide range of applications. With a nominal supply voltage of 5V and a maximum supply current of 265 mA, this graphics processor delivers exceptional value, efficiency, and power to meet all your needs. Upgrade your system today and unleash the full potential of your graphics with Texas Instruments!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, making the GPU suitable for harsh environments and extended use.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power requirements and compatibility with various systems.

Package Shape: SQUARE

The square package shape makes it easier to mount and integrate the GPU into different devices.

No. of Terminals: 145

Having a high number of terminals enables efficient connectivity and communication within the GPU and with external components.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the GPU can withstand extreme temperature conditions, making it suitable for rugged applications.

Maximum Bits Per Pixel: 32

This high value allows for high-quality graphics rendering and display, making the GPU ideal for demanding visual applications.

Technical Specifications

Graphics Processors (GPUs) SM34020AGBM32 attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

JESD-30 Code:

S-CPGA-P145

Length:

39.75 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

145

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA145,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.21 mm

Sub-Category:

Graphics Processors

Maximum Supply Current:

265 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

39.75 mm

Peripheral IC Type:

Trade Compliance

SM34020AGBM32 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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