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TMS27C64-1JE

Texas Instruments

TMS27C64-1JE by Texas Instruments

TMS27C64-1JE by Texas Instruments is an 8KX8 EPROM with 150 ns access time, 5V supply voltage, and 3-STATE output. It is used in industrial applications for storing data securely due to its UVPROM technology and common I/O type.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,924 parts In-Stock

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3,924

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Digiode

USA . 54 parts In-Stock

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54

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Q Components

USA . 2 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 262 parts In-Stock

1+ parts

$1.954

100+ parts

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$2.488

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262

$1.954

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$2.488

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ChromeModa Solutions

Germany . 3,598 parts In-Stock

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$2.196

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$1.801

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3,598

$2.196

$1.801

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IDEA Electronic Components Group

UK . 2,378 parts In-Stock

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$2.196

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$1.976

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2,378

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$1.976

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One Stop Electronics

USA . 1,444 parts In-Stock

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$4.000

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$4.000

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AZTECH Wire

Italy . 823 parts In-Stock

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$12.367

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823

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Corphita

USA . 3,729 parts In-Stock

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DigiPath Technology Company

USA . 2,091 parts In-Stock

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$1.980

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$1.980

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Overview

Unlock the power of reliable memory storage with the TMS27C64-1JE EPROM by Texas Instruments. Crafted with precision and quality, this innovative technology offers customers a seamless solution for storing data in industrial applications. With a robust package body material and optimal operating mode, this EPROM ensures maximum performance and durability. Experience the unmatched value and benefits of Texas Instruments' EPROM technology, providing customers with a trusted solution for their memory storage needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired package body material provides good durability and reliability for the EPROM, making it a suitable choice for long-term usage.

Operating Mode: ASYNCHRONOUS

Asynchronous operation mode allows for independent operation of the EPROM, enhancing its versatility and usability in various applications.

Nominal Supply Voltage / Vsup (V): 5

Nominal supply voltage of 5V ensures compatibility with standard power supply systems, making integration and operation of the EPROM convenient.

Output Characteristics: 3-STATE

3-state output characteristics enable the EPROM to effectively isolate its output from the rest of the system, providing efficient control and signal management.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the EPROM energy-efficient and reliable for data storage and retrieval.

Technical Specifications

EPROM TMS27C64-1JE attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

150 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T28

Length:

36.83 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Programming Voltage (V):

12.5

Qualification:

Not Qualified

Maximum Seated Height:

4.907 mm

Maximum Standby Current:

.00025 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TMS27C64-1JE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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