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TMS27C240-15JL

Texas Instruments

TMS27C240-15JL by Texas Instruments

TMS27C240-15JL by Texas Instruments is a 256KX16 EPROM with 150 ns access time, operating at 5V. It features a CMOS technology, 3-STATE output characteristics, and through-hole terminal form. Ideal for applications requiring fast memory access in commercial temperature environments.

Median Price

$8.205

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 6 parts In-Stock

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$6.330

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$6.330

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Bristol Electronics

USA . 39 parts In-Stock

1+ parts

$10.080

100+ parts

$4.704

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39

$10.080

$4.704

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Vyrian

USA . 3,560 parts In-Stock

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Digiode

USA . 2,640 parts In-Stock

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2,640

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Corel Iberica Componentes, S.L.

Spain . 51 parts In-Stock

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GES GmbH

Germany . 39 parts In-Stock

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Microfarads

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Prism Electronics

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Electronics Depot

USA . 1 parts In-Stock

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Inland Empire Components Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 573 parts In-Stock

1+ parts

$4.465

100+ parts

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$4.900

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573

$4.465

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$4.900

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DigiPath Technology Company

USA . 938 parts In-Stock

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$4.917

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$4.523

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938

$4.917

$4.523

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ChromeModa Solutions

Germany . 2,170 parts In-Stock

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$5.017

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$4.114

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2,170

$5.017

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IDEA Electronic Components Group

UK . 510 parts In-Stock

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$5.017

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$4.515

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510

$5.017

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AZTECH Wire

Italy . 791 parts In-Stock

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$10.304

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$10.304

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One Stop Electronics

USA . 1,084 parts In-Stock

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$23.000

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Corphita

USA . 1,540 parts In-Stock

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Kepictronics

USA . 600 parts In-Stock

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600

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Perfect Parts

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Assy Fe

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A-Plus Industry Inc.

USA . 1 parts In-Stock

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Overview

Unlock the power of reliable and high-quality memory with the TMS27C240-15JL by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch performance and durability. This EPROM device is perfect for a wide range of applications, offering customers exceptional value and benefits. Whether you're looking to upgrade your computer systems or enhance your electronics projects, the TMS27C240-15JL delivers seamless operation and efficiency. Trust Texas Instruments to provide premium products that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection for the EPROM, making it reliable for long-term use.

Nominal Supply Voltage / Vsup (V): 5

The EPROM operates at a standard voltage of 5V, making it compatible with most systems and easy to integrate into existing setups.

No. of Terminals: 40

With 40 terminals, the EPROM offers a sufficient amount of connectivity options for versatile applications.

Maximum Operating Temperature: 70 °C

The EPROM can operate effectively in high-temperature environments up to 70°C, ensuring reliable performance under varying conditions.

Memory Density: 4194304 bit

The high memory density of the EPROM allows for storage of a large amount of data, making it suitable for complex applications that require extensive memory capacity.

Technical Specifications

EPROM TMS27C240-15JL attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

150 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T40

Length:

52.07 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

40

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.91 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TMS27C240-15JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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