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TLV320AC57N

Texas Instruments

TLV320AC57N by Texas Instruments

TLV320AC57N by Texas Instruments is a BASEBAND CIRCUIT for cellphones. It operates b/w -40 to 85°C, with 20 terminals in a RECTANGULAR package style. Nominal voltage is 3V, making it suitable for industrial telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,990 parts In-Stock

1+ parts

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6,990

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Digiode

USA . 1,351 parts In-Stock

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1,351

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,744 parts In-Stock

1+ parts

$10.512

100+ parts

-

1k+ parts

$11.022

10k+ parts

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1,744

$10.512

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$11.022

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DigiPath Technology Company

USA . 2,013 parts In-Stock

1+ parts

$11.575

100+ parts

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2,013

$11.575

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ChromeModa Solutions

Germany . 2,772 parts In-Stock

1+ parts

$11.811

100+ parts

$9.685

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2,772

$11.811

$9.685

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IDEA Electronic Components Group

UK . 2,235 parts In-Stock

1+ parts

$11.811

100+ parts

$11.220

1k+ parts

$10.630

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2,235

$11.811

$11.220

$10.630

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AZTECH Wire

Italy . 197 parts In-Stock

1+ parts

$18.539

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197

$18.539

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One Stop Electronics

USA . 1,515 parts In-Stock

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$752.000

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1,515

$752.000

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Corphita

USA . 815 parts In-Stock

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815

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Overview

Unlock the potential of your cellphone designs with the Texas Instruments TLV320AC57N, a high-quality Baseband Circuit Telecom IC that combines reliability and innovation. Manufactured by industry leader Texas Instruments, this versatile component offers unmatched value and benefits for your projects. From improved audio quality to enhanced communication capabilities, the TLV320AC57N is the perfect solution for your cellphone IC needs. Trust Texas Instruments for cutting-edge technology and superior performance in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic is a durable and lightweight material, making the IC package robust and easy to handle.

No. of Terminals: 20

With 20 terminals, this IC provides a sufficient number of connections for various functions and features.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in warm environments.

Nominal Supply Voltage: 3 V

A 3V supply voltage makes this IC suitable for low-power applications, helping to conserve energy.

Telecom IC Type: BASEBAND CIRCUIT

As a baseband circuit IC, this product is designed for handling essential communication functions in a cellphone, ensuring efficient signal processing.

Technical Specifications

Cellphone ICs TLV320AC57N attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TLV320AC57N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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