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SN74LS670D

Texas Instruments

SN74LS670D by Texas Instruments

SN74LS670D by Texas Instruments is a 16-bit SRAM with 4x4 organization, operating at 5V. It features a max clock frequency of 35MHz and offers a standby current of 0.05A. Ideal for applications requiring fast access times and low power consumption in commercial temperature grades.

Median Price

$1.663

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,168 parts In-Stock

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-

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$1.480

1k+ parts

$1.330

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$1.250

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$1.480

$1.330

$1.250

DigiKey

USA . 15,168 parts In-Stock

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$1.950

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$1.950

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Verical

USA . 8,960 parts In-Stock

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$1.663

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$1.563

8,960

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$1.663

$1.563

Distributors (In-Stock)

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Vyrian

USA . 2,026 parts In-Stock

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$1.325

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$1.325

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Digiode

USA . 3,817 parts In-Stock

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$1.358

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Chip Stock

USA . 51,000 parts In-Stock

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DigiKey Marketplace

USA . 6,101 parts In-Stock

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$1.300

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$1.300

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Mil-Aero Solutions, Inc.

USA . 742 parts In-Stock

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742

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Bristol Electronics

USA . 283 parts In-Stock

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$1.500

1k+ parts

$0.900

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283

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$1.500

$0.900

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ACDS - Activité Composants Distribution Service

France . 198 parts In-Stock

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Electronic Expediters

USA . 90 parts In-Stock

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Q Components

USA . 28 parts In-Stock

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A2Z Electronics, Inc.

USA . 25 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 15 parts In-Stock

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Microfarads

USA . 10 parts In-Stock

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Elcom Components

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Distributors (Availability)

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Corohmni

South Africa . 124 parts In-Stock

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$1.229

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$1.229

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Corphita

USA . 4,730 parts In-Stock

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$1.287

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$1.287

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Parana Technologies

USA . 1,500 parts In-Stock

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$4.621

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$5.092

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1,500

$4.621

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$5.092

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DigiPath Technology Company

USA . 2,156 parts In-Stock

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$5.088

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2,156

$5.088

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ChromeModa Solutions

Germany . 6,572 parts In-Stock

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$5.192

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$4.257

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$5.192

$4.257

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IDEA Electronic Components Group

UK . 2,359 parts In-Stock

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$5.192

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$4.673

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2,359

$5.192

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$4.673

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Microchip USA

USA . 137 parts In-Stock

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$22.070

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$22.000

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$22.000

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$21.930

137

$22.070

$22.000

$22.000

$21.930

QUARKTWIN TECHNOLOGY LTD

USA . 11,916 parts In-Stock

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Problanco Electronics

Mexico . 7,826 parts In-Stock

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TANS Electronics

Latvia . 5,712 parts In-Stock

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Kulean Microsystems

USA . 1,872 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 613 parts In-Stock

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SupplyDigital Components

Austria . 532 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 198 parts In-Stock

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Glotronic Ltd.

UK . 158 parts In-Stock

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Assy Fe

Spain . 142 parts In-Stock

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Overview

Enhance your electronic projects with the high-quality SN74LS670D SRAM by Texas Instruments. This versatile memory IC offers reliable performance and fast access time, making it ideal for a wide range of applications. Whether you're designing consumer electronics or industrial automation systems, this product delivers value and efficiency. Trust in the expertise of Texas Instruments and experience the benefits of cutting-edge technology with the SN74LS670D.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and resistance to external factors, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V provides compatibility with a wide range of systems and ensures stable performance.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand heat and operate reliably in demanding environments.

Maximum Clock Frequency (fCLK): 35 MHz

Capable of operating at a maximum clock frequency of 35 MHz, this SRAM chip offers high-speed data processing and efficient performance.

Technology: TTL

Using TTL technology, this SRAM chip ensures compatibility with TTL logic levels, providing ease of integration into various digital systems.

Memory Width: 4

With a memory width of 4, this SRAM chip can handle and process data in 4-bit chunks, enabling efficient storage and retrieval of information.

Maximum Standby Current: 0.05 Amp

Having a low standby current of 0.05 Amps helps minimize power consumption when the chip is not actively in use, promoting energy efficiency.

Maximum Access Time: 45 ns

With a fast access time of 45 nanoseconds, this SRAM chip can quickly retrieve stored data, enhancing overall system performance.

Technical Specifications

SRAM SN74LS670D attributes and parameters. Explore more SRAM devices from Texas Instruments

Specs

Maximum Access Time:

45 ns

Maximum Clock Frequency (fCLK):

35 MHz

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Memory Density:

16 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

16

No. of Words:

4 words

No. of Words Code:

4

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4X4

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Standby Current:

.05 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Trade Compliance

SN74LS670D Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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