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SN74LS170N3

Texas Instruments

SN74LS170N3 by Texas Instruments

SN74LS170N3 by Texas Instruments is a TTL memory IC with 16 terminals and a supply voltage of 5V. It operates b/w 0-70°C, making it suitable for commercial applications. The package style is in-line rectangular plastic/epoxy, ideal for various function memory circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,369 parts In-Stock

1+ parts

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8,369

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Digiode

USA . 951 parts In-Stock

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951

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,612 parts In-Stock

1+ parts

$4.706

100+ parts

-

1k+ parts

$5.195

10k+ parts

-

1,612

$4.706

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$5.195

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One Stop Electronics

USA . 1,111 parts In-Stock

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$5.000

100+ parts

-

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1,111

$5.000

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ChromeModa Solutions

Germany . 5,228 parts In-Stock

1+ parts

$5.288

100+ parts

$4.336

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5,228

$5.288

$4.336

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IDEA Electronic Components Group

UK . 632 parts In-Stock

1+ parts

$5.288

100+ parts

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$4.759

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632

$5.288

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$4.759

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AZTECH Wire

Italy . 371 parts In-Stock

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$19.529

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371

$19.529

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Corphita

USA . 4,941 parts In-Stock

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4,941

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DigiPath Technology Company

USA . 286 parts In-Stock

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$4.768

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286

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$4.768

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Overview

Discover the ultimate solution for your memory IC needs with the SN74LS170N3 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers unmatched performance and reliability in the electronics industry. This versatile IC is perfect for various applications, offering customers exceptional value and benefits. Upgrade your projects with ease and confidence using the SN74LS170N3 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the longevity of the memory IC.

Nominal Supply Voltage: 5V

A 5V supply voltage is commonly used in many electronic devices, making this memory IC compatible with a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and mounting in various electronic circuits and systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this memory IC can withstand moderate levels of heat, ensuring reliable performance.

Technology: TTL

TTL (Transistor-Transistor Logic) technology offers fast switching speeds and low power consumption, making this memory IC efficient and reliable for use in electronic devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides easy and secure connections to circuit boards, ensuring stable performance in various electronic applications.

Technical Specifications

Other Function Memory ICs SN74LS170N3 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Other Memory ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS170N3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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