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SM32C6416TBGLZA8EP

Texas Instruments

SM32C6416TBGLZA8EP by Texas Instruments

Texas Instruments SM32C6416TBGLZA8EP is a 32-bit DSP with integrated cache and 532 terminals. It operates at a max frequency of 100 MHz, suitable for industrial applications requiring high-speed processing. With low power mode and boundary scan support, it offers efficient performance in digital signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,318 parts In-Stock

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Vyrian

USA . 2,148 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 454 parts In-Stock

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$7.295

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454

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One Stop Electronics

USA . 1,642 parts In-Stock

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$15.000

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Ampacity Inc.

Singapore . 1,019 parts In-Stock

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$31.000

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Microchip USA

USA . 2,063 parts In-Stock

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$34.500

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$34.000

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$33.760

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$33.510

2,063

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$33.760

$33.510

Parana Technologies

USA . 680 parts In-Stock

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$63.065

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680

$63.065

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ChromeModa Solutions

Germany . 6,333 parts In-Stock

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$70.859

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$58.104

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$70.859

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IDEA Electronic Components Group

UK . 1,830 parts In-Stock

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$70.859

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$67.316

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$63.773

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$63.773

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Corohmni

South Africa . 3,215 parts In-Stock

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$321.165

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Lixinc

USA . 18,150 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,800 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 1,863 parts In-Stock

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DigiPath Technology Company

USA . 1,605 parts In-Stock

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$63.886

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Kepictronics

USA . 320 parts In-Stock

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Perfect Parts

USA . 67 parts In-Stock

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GreenTree Electronics

Israel . 45 parts In-Stock

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Overview

Experience seamless and efficient digital signal processing with the SM32C6416TBGLZA8EP by Texas Instruments. Built with top-notch quality and reliability, this DSP offers unparalleled performance for a wide range of applications. From audio processing to telecommunications, this versatile product is designed to deliver exceptional value and benefits to customers. Trust in Texas Instruments' expertise in manufacturing cutting-edge technology to take your projects to the next level. Elevate your processing capabilities with the SM32C6416TBGLZA8EP today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices or applications where weight is a concern.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the DSP, enabling faster data access and processing which is essential for real-time signal processing applications.

Surface Mount: YES

Surface mount capability simplifies the PCB assembly process, reduces manufacturing cost, and allows for compact designs, making the DSP suitable for space-constrained applications.

Maximum Supply Voltage: 1.24 V

Operating within a low maximum supply voltage range enhances the energy efficiency and prolongs the battery life in battery-powered devices.

Address Bus Width: 32

A wider address bus width allows for efficient memory addressing and data transfer, enabling the DSP to handle complex algorithms and process large amounts of data simultaneously.

Package Shape: SQUARE

A square package shape maximizes space utilization on the PCB, facilitating easier layout and assembly of components in the system.

Bit Size: 32

Operating with a 32-bit architecture provides high computational capability and precision, enabling the DSP to perform intricate signal processing tasks accurately.

Power Supplies (V): 1.2,3.3

Offering multiple power supply options gives flexibility in system design and compatibility with various power sources, ensuring reliable operation in diverse environments.

No. of Terminals: 532

Having a high number of terminals allows for extensive connectivity options and interfacing with other components, making the DSP versatile for a wide range of applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enable high-density mounting, reducing signal interference and improving electrical performance in high-frequency applications.

Minimum Supply Voltage: 1.16 V

Operating at a low minimum supply voltage ensures power efficiency and stability, especially during low-power mode operation, enhancing overall energy-saving capabilities.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the DSP can withstand harsh environmental conditions and maintain reliable performance in industrial and automotive applications.

No. of External Interrupts: 4

Having multiple external interrupts allows the DSP to respond promptly to external events or triggers, enhancing real-time responsiveness in signal processing tasks.

Minimum Operating Temperature: -40 °C

Operating at a low minimum temperature enables reliable functionality in cold environments or outdoor settings, making the DSP suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides excellent solderability and long-term reliability, ensuring secure connections during PCB assembly and enhancing the product's overall lifespan.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and component placement, allowing for efficient heat dissipation and improving thermal management in the system.

Maximum Seated Height: 3.25 mm

With a low seated height, the DSP can be incorporated into compact designs or slim devices without compromising on performance or thermal dissipation capabilities.

RAM Words: 4096

Having a large RAM capacity allows the DSP to store and access a significant amount of data quickly, facilitating smoother operation and efficient multitasking.

Width: 23 mm

A compact width dimension enables easy integration into space-constrained systems or applications where size is a critical factor, without sacrificing on performance or functionality.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, ensuring easy identification and resolution of any potential manufacturing or operational issues in the system.

External Data Bus Width: 32

Operating with a 32-bit external data bus width enables high-speed data transfer between the DSP and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 100 MHz

With a high maximum clock frequency, the DSP can perform rapid data processing and execute complex algorithms efficiently, making it suitable for demanding signal processing tasks.

Maximum Time At Peak Reflow Temperature (s): 20

The ability to withstand peak reflow temperatures for an extended duration ensures reliable solder connections and robust performance during the manufacturing process.

Peak Reflow Temperature °C: 220

The high peak reflow temperature capability enables the DSP to endure the soldering process without damage, ensuring stable and reliable operation in various manufacturing environments.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal bus architecture enhances data throughput and parallel processing capabilities, allowing the DSP to handle complex algorithms and large data sets efficiently.

Length: 23 mm

A compact length dimension facilitates easy integration and layout flexibility in system design, ensuring compatibility with various form factors and space-constrained applications.

Temperature Grade: INDUSTRIAL

Operating within an industrial temperature grade range ensures reliable performance in harsh conditions and extended operating environments, making the DSP suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of digital signal processor and other integrated circuits present versatile interfacing options and connectivity features, enhancing the DSP's functionality and application scope.

No. of Timers: 3

Having multiple timers enables precise event timing and coordination within the DSP, essential for synchronizing various signal processing tasks and improving overall system efficiency.

Technology: CMOS

Operating on CMOS technology ensures low power consumption, high-speed operation, and reliable performance, making the DSP energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form facilitates reliable solder connections, improves electrical performance, and simplifies PCB assembly, ensuring robust and long-lasting deployment of the DSP.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage of 1.2 V optimizes power efficiency, extends battery life, and ensures stable performance in low-power mode, making the DSP suitable for energy-sensitive applications.

No. of DMA Channels: 64

With a high number of DMA channels, the DSP can efficiently manage data transfer tasks and offload processing from the main CPU, enhancing overall system performance and data throughput.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm enables high-density mounting, reduces signal interference, and improves electrical performance, making the DSP suitable for high-frequency applications.

Format: FIXED POINT

Operating in a fixed-point format simplifies arithmetic operations, reduces computational complexity, and enhances overall processing speed, making the DSP suitable for real-time signal processing tasks.

Moisture Sensitivity Level (MSL): 4

Having a moderate moisture sensitivity level of 4 ensures the DSP's reliability during manufacturing, storage, and operation in humid environments, preventing potential damage or malfunctions.

Low Power Mode: YES

The low power mode capability enhances energy efficiency, prolongs battery life, and reduces power consumption during idle or standby modes, making the DSP ideal for portable and battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) SM32C6416TBGLZA8EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

4096

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

23 mm

Peripheral IC Type:

Trade Compliance

SM32C6416TBGLZA8EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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