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SM320F28335GBS

Texas Instruments

SM320F28335GBS by Texas Instruments

Texas Instruments SM320F28335GBS is a 32-bit DSP with 20-bit address bus, operating at up to 100 MHz. Ideal for military applications, it features 181 terminals, 8 external interrupts, and low power mode for efficient performance.

Median Price

$403.055

Lifecycle Status

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6

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1k+

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Texas Instruments

USA . 106 parts In-Stock

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$403.055

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$335.879

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Digiode

USA . 2,622 parts In-Stock

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$382.902

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Vyrian

USA . 3,438 parts In-Stock

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Chip Stock

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Nova Conductors

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Bristol Electronics

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AZTECH Wire

Italy . 199 parts In-Stock

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$8.800

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Corohmni

South Africa . 5,179 parts In-Stock

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$18.752

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Parana Technologies

USA . 118 parts In-Stock

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ChromeModa Solutions

Germany . 4,336 parts In-Stock

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$54.665

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$44.825

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IDEA Electronic Components Group

UK . 128 parts In-Stock

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$54.665

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$51.932

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$49.198

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Ampacity Inc.

Singapore . 106 parts In-Stock

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$342.600

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Corphita

USA . 4,039 parts In-Stock

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$362.750

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Component Stockers USA

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Lixinc

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Futuretech Components

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Kepictronics

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DigiPath Technology Company

USA . 1,669 parts In-Stock

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Microchip USA

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Epart123

USA . 1,200 parts In-Stock

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Netroflash

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Perfect Parts

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Overview

Enhance your digital signal processing capabilities with the SM320F28335GBS by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. This DSP offers unparalleled performance and reliability, making it ideal for a wide range of applications in industries such as automotive, industrial automation, and telecommunications. With its cutting-edge technology and advanced features, this product provides customers with exceptional value, efficiency, and flexibility to meet their unique requirements. Upgrade your systems with the SM320F28335GBS and experience a new level of innovation and excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material provides excellent durability and protection for the DSP, ensuring long-term reliability in various operating conditions.

Maximum Supply Voltage: 1.995 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating various voltage levels for optimal performance.

Address Bus Width: 20

With a wide address bus width, this DSP can handle complex data addressing tasks efficiently, enhancing overall processing speed.

Package Shape: SQUARE

The square package shape facilitates easy integration and mounting on PCBs, saving space and simplifying the overall design process.

Bit Size: 32

The 32-bit architecture allows for high-speed processing of data and complex algorithms, making it suitable for demanding signal processing tasks.

Power Supplies (V): 1.9,3.3

Support for multiple power supply options enables compatibility with different systems and voltage requirements, increasing versatility.

No. of Terminals: 181

The ample number of terminals provides connectivity options for various external components, making it a versatile choice for diverse applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers enhanced thermal performance and reliability, crucial for sustained operation in demanding environments.

Minimum Supply Voltage: 1.805 V

The low minimum supply voltage ensures efficient power consumption and allows for operation in low-power scenarios, enhancing energy efficiency.

Maximum Operating Temperature: 210 °C

The high maximum operating temperature tolerance makes this DSP suitable for harsh environmental conditions, ensuring reliable performance in extreme heat.

CPU Family: C28X

Belonging to the C28X CPU family provides access to a range of powerful processing capabilities and features tailored for signal processing applications.

No. of External Interrupts: 8

The 8 external interrupts allow for efficient handling of external events and real-time responses, enhancing the DSP's versatility and responsiveness.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this DSP can withstand extreme cold conditions, making it suitable for a wide range of operating environments.

ADC Channels: YES

The inclusion of ADC channels enables analog-to-digital conversion, essential for processing real-world signals and data in various applications.

Terminal Position: PERPENDICULAR

The perpendicular terminal position simplifies PCB layout and installation, facilitating easy integration and enhancing overall system design flexibility.

Maximum Seated Height: 4.7 mm

The low maximum seated height allows for compact system designs and efficient heat dissipation, ideal for space-constrained applications.

RAM Words: 17408

With a large RAM capacity of 17408 words, this DSP can efficiently store and manipulate data, enabling high-performance signal processing tasks.

Width: 40.01 mm

The moderate width of 40.01 mm provides a balance between compact size and sufficient space for components, offering flexibility in system integration.

Boundary Scan: YES

The support for boundary scan testing aids in debugging and verification during the manufacturing process, ensuring product quality and reliability.

External Data Bus Width: 32

The wide external data bus width of 32 bits allows for high-speed data transfer and processing, enhancing overall system performance.

Maximum Clock Frequency: 100 MHz

The high maximum clock frequency of 100 MHz enables rapid data processing and real-time operations, making it suitable for time-critical applications.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow and communication within the DSP, facilitating efficient processing of complex algorithms.

Length: 40.01 mm

The length of 40.01 mm provides a compact form factor while offering sufficient space for component placement, enabling versatile system designs.

Temperature Grade: MILITARY

Built to military-grade standards, this DSP is rugged and reliable, suitable for mission-critical applications where durability and performance are paramount.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

As a digital signal processor with additional peripheral IC capabilities, this product offers a comprehensive solution for diverse signal processing requirements.

No. of Timers: 13

With 13 timers, this DSP can manage multiple timing tasks and synchronization requirements, enhancing its functionality in time-sensitive applications.

RAM Bytes: 69632

The substantial RAM capacity of 69632 bytes allows for efficient data storage and manipulation, supporting complex signal processing algorithms and tasks.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, making this DSP energy-efficient and suitable for demanding applications.

Terminal Form: PIN/PEG

The PIN/PEG terminal form provides secure and reliable connections, ensuring stable operation and ease of integration into various system configurations.

Maximum Supply Current: 350 mA

The maximum supply current of 350 mA supports stable and reliable operation, meeting the power requirements of the DSP for consistent performance.

Nominal Supply Voltage: 1.9 V

The 1.9 V nominal supply voltage offers a balance between power efficiency and performance, providing reliable operation for a wide range of applications.

No. of DMA Channels: 6

With 6 DMA channels, this DSP can efficiently manage data transfer tasks, reducing the workload on the CPU and improving overall system performance.

PWM Channels: YES

The presence of PWM channels enables precise control over analog signal outputs, essential for applications requiring accurate modulation and control.

ROM Programmability: OTPROM

Featuring OTPROM programmability, this DSP offers flexibility for firmware updates and customization, ensuring adaptability to evolving application requirements.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for compatibility with common connectors and headers, simplifying PCB layout and integration.

Format: FLOATING POINT

Supporting floating-point operations, this DSP can handle complex mathematical computations with high precision and accuracy, ideal for scientific and engineering applications.

Low Power Mode: YES

The low power mode option enables energy-efficient operation, extending battery life and reducing overall power consumption, making it a sustainable choice.

On Chip Program ROM Width: 16

With a 16-bit on-chip program ROM width, this DSP can efficiently store program code, enhancing processing speed and overall system performance.

Technical Specifications

Digital Signal Processors (DSPs) SM320F28335GBS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P181

Length:

40.01 mm

Low Power Mode:

YES

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of Terminals:

181

No. of Timers:

13

On Chip Program ROM Width:

16

Maximum Operating Temperature:

210 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA181,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

69632

RAM Words:

17408

ROM Programmability:

OTPROM

Maximum Seated Height:

4.7 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.805 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

40.01 mm

Peripheral IC Type:

Trade Compliance

SM320F28335GBS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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