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SM320F2808PZMEP

Texas Instruments

SM320F2808PZMEP by Texas Instruments

The Texas Instruments SM320F2808PZMEP is a 32-bit DSP with 16-bit on-chip data RAM, operating at up to 100 MHz. Ideal for digital signal processing applications, it features 3 external interrupts, ADC channels, and PWM channels. With a low power mode and flash ROM programmability, this CMOS technology device is suitable for military-grade temperature environments.

Median Price

$52.415

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,243 parts In-Stock

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$49.030

100+ parts

$35.768

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$34.380

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$49.030

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Mouser Electronics

USA . 2 parts In-Stock

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$55.800

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$40.960

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$55.800

$40.960

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Digiode

USA . 4,201 parts In-Stock

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$38.522

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Vyrian

USA . 8,914 parts In-Stock

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Chip Stock

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Bisco

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Component Sense

UK . 62 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 11 parts In-Stock

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Advanced Electronics

New Zealand . 2,286 parts In-Stock

1+ parts

$24.269

100+ parts

$24.027

1k+ parts

$23.056

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$24.269

$24.027

$23.056

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Parana Technologies

USA . 1,013 parts In-Stock

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$32.546

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$107.660

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$32.546

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Corphita

USA . 4,191 parts In-Stock

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$36.495

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ChromeModa Solutions

Germany . 3,531 parts In-Stock

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$36.568

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$29.986

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3,531

$36.568

$29.986

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IDEA Electronic Components Group

UK . 1,720 parts In-Stock

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$36.568

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$34.740

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$32.911

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1,720

$36.568

$34.740

$32.911

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Corohmni

South Africa . 87 parts In-Stock

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$79.978

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$79.978

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Microchip USA

USA . 1,102 parts In-Stock

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$90.440

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$88.860

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$88.080

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$87.290

1,102

$90.440

$88.860

$88.080

$87.290

QUARKTWIN TECHNOLOGY LTD

USA . 28,846 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Kepictronics

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iodParts Technologies Inc.

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DigiPath Technology Company

USA . 371 parts In-Stock

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$32.970

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Perfect Parts

USA . 269 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Overview

Experience the power and precision of the SM320F2808PZMEP by Texas Instruments, a top-tier manufacturer known for delivering exceptional digital signal processors. This cutting-edge device offers unmatched performance in a variety of applications, from industrial automation to consumer electronics. With advanced features and reliable operation, this DSP provides value, benefits, and advantages that exceed customer expectations. Upgrade your projects with the quality and innovation of Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the DSP, making it easy to handle and transport.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.89 V

Efficiently operates at a low voltage level, helping to reduce power consumption.

On Chip Data RAM Width: 16

Provides ample on-chip memory for storing data, enhancing processing speed and efficiency.

Package Shape: SQUARE

Facilitates easy arrangement and layout on the circuit board, optimizing space usage.

Bit Size: 32

Offers high processing power and accuracy for complex signal processing tasks.

Power Supplies (V): 1.8,3.3

Supports multiple power supply options, allowing flexibility in system design and integration.

No. of Terminals: 100

Provides numerous connection points for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Offers different packaging options to suit specific application requirements and PCB designs.

Minimum Supply Voltage: 1.71 V

Ensures stable operation even at lower supply voltages, enhancing reliability and performance.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for demanding environmental conditions.

CPU Family: C28X

Belongs to a reliable and proven CPU family known for efficient signal processing capabilities.

No. of External Interrupts: 3

Supports multiple external interrupts, enabling real-time response to external events.

Minimum Operating Temperature: -55 °C

Capable of functioning in harsh cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides a durable and reliable terminal finish for long-term connectivity and signal integrity.

ADC Channels: YES

Includes built-in ADC channels for analog signal acquisition and processing.

Terminal Position: QUAD

Quad terminal layout allows for easy soldering and connectivity with other components.

Maximum Seated Height: 1.6 mm

Low-profile design minimizes the overall height of the package, ideal for space-constrained applications.

RAM Words: 9216

Generous on-chip RAM capacity for storing and manipulating data in real-time signal processing tasks.

Width: 14 mm

Compact width size enables easy integration into various PCB layouts and space-restricted designs.

Boundary Scan: YES

Boundary scan feature offers enhanced testing and debugging capabilities for improved reliability.

Maximum Clock Frequency: 100 MHz

High clock frequency supports fast processing speeds for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized reflow profile ensures proper soldering of the DSP during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly, ensuring reliable solder joints.

Internal Bus Architecture: MULTIPLE

Utilizes a multiple bus architecture for efficient data transfer and communication between internal components.

Length: 14 mm

Compact length size for easy placement and integration in a variety of electronic systems.

Temperature Grade: MILITARY

Designed to meet stringent military-grade specifications for rugged and reliable performance in harsh environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile IC type suitable for diverse digital signal processing applications and peripheral interfacing.

RAM Bytes: 36864

Large RAM capacity in bytes for storing and processing a significant amount of data efficiently.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high speed, and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint reliability and mechanical strength in surface mount applications.

Maximum Supply Current: 230 mA

Moderate supply current requirement for efficient power usage and extended battery life in portable devices.

Nominal Supply Voltage: 1.8 V

Stable and standard supply voltage for consistent performance and compatibility with other components.

PWM Channels: YES

Includes PWM channels for precise control of digital signals and power modulation in various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for convenient firmware updates and customization of signal processing algorithms.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and precise placement on the PCB.

Format: FIXED POINT

Fixed-point format for efficient arithmetic calculations and signal processing operations.

Moisture Sensitivity Level (MSL): 3

MSL level 3 ensures safe handling and assembly of the DSP in moisture-sensitive environments.

Low Power Mode: YES

Includes low power mode for energy-efficient operation and extended battery life in power-constrained applications.

On Chip Program ROM Width: 16

Ample on-chip program ROM width for storing firmware, software code, and instructions for efficient signal processing.

Technical Specifications

Digital Signal Processors (DSPs) SM320F2808PZMEP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

100

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

9216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SM320F2808PZMEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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