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SM320C6455BGTZSEP

Texas Instruments

SM320C6455BGTZSEP by Texas Instruments

Texas Instruments' SM320C6455BGTZSEP is a 32-bit DSP with integrated cache, 64 DMA channels, and 66.6 MHz clock frequency. Ideal for digital signal processing applications requiring low power mode and fixed point format. Features include 20-bit address bus width, 64-bit external data bus width, and max operating temperature of 105°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,792 parts In-Stock

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Digiode

USA . 3,080 parts In-Stock

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Chip Stock

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Microchip USA

USA . 2,380 parts In-Stock

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$6.490

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$6.450

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$6.430

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$6.410

2,380

$6.490

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$6.410

One Stop Electronics

USA . 691 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 243 parts In-Stock

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$11.606

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Parana Technologies

USA . 987 parts In-Stock

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$23.478

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$24.112

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987

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$23.742

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$21.605

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$19.468

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500

$23.742

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$19.468

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DigiPath Technology Company

USA . 845 parts In-Stock

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$25.852

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$23.784

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ChromeModa Solutions

Germany . 5,534 parts In-Stock

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$26.380

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$21.632

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IDEA Electronic Components Group

UK . 1,437 parts In-Stock

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$26.380

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$25.061

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$23.742

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$23.742

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Corohmni

South Africa . 1,240 parts In-Stock

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$82.774

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Lixinc

USA . 11,598 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

USA . 3,000 parts In-Stock

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Corphita

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Perfect Parts

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Overview

Experience unparalleled performance and efficiency with the SM320C6455BGTZSEP by Texas Instruments. As a leading manufacturer of Digital Signal Processors (DSPs), Texas Instruments delivers exceptional quality and reliability in every product. This versatile DSP is perfect for a wide range of applications, offering integrated cache, multiple power supplies, and boundary scan capabilities. With advanced technology and a wide array of features, the SM320C6455BGTZSEP provides unmatched value and benefits to customers seeking top-notch performance in their designs. Elevate your projects with this cutting-edge DSP from Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Integrated Cache: YES

Having an integrated cache helps in reducing memory latency and improving overall processing speed.

Maximum Supply Voltage: 1.2875 V

The maximum supply voltage allows for efficient power consumption while maintaining performance.

Address Bus Width: 20

A wider address bus width allows for accessing a larger memory space, enabling more complex processing tasks.

Bit Size: 32

A 32-bit architecture enables the processor to handle data in larger chunks, enhancing computational capabilities.

Power Supplies (V): 1.2,1.8,3.3

Support for multiple power supply voltages offers flexibility in different operating scenarios.

No. of Terminals: 697

A high number of terminals allows for efficient connectivity and signal processing capabilities.

RAM Words: 32768

With a large RAM capacity, the processor can store and manipulate a significant amount of data efficiently.

Maximum Clock Frequency: 66.6 MHz

The high maximum clock frequency allows for fast processing and response times in demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for digital signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) SM320C6455BGTZSEP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V I/O SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e0

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

697

No. of Timers:

4

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

3.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.2875 V

Minimum Supply Voltage:

1.2125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SM320C6455BGTZSEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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