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OMAPL138BZWTA3R

Texas Instruments

OMAPL138BZWTA3R by Texas Instruments

OMAPL138BZWTA3R by Texas Instruments is a DSP with 16-bit external data bus, 23-bit address bus, and max clock frequency of 30 MHz. Ideal for low power applications in digital signal processing due to its CMOS technology and floating point format. Suitable for various electronic devices requiring high-performance signal processing capabilities.

Median Price

$32.794

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 512 parts In-Stock

1+ parts

-

100+ parts

$29.150

1k+ parts

$26.080

10k+ parts

$24.540

512

-

$29.150

$26.080

$24.540

DigiKey

USA . 512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

512

-

-

-

-

Verical

USA . 246 parts In-Stock

1+ parts

-

100+ parts

$36.438

1k+ parts

$32.600

10k+ parts

$30.675

246

-

$36.438

$32.600

$30.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,011 parts In-Stock

1+ parts

$30.770

100+ parts

-

1k+ parts

-

10k+ parts

-

3,011

$30.770

-

-

-

Vyrian

USA . 6,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,799

-

-

-

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DigiKey Marketplace

USA . 665 parts In-Stock

1+ parts

-

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-

1k+ parts

-

10k+ parts

-

665

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 330 parts In-Stock

1+ parts

$20.483

100+ parts

-

1k+ parts

$20.545

10k+ parts

-

330

$20.483

-

$20.545

-

DigiPath Technology Company

USA . 223 parts In-Stock

1+ parts

$22.555

100+ parts

$20.750

1k+ parts

-

10k+ parts

-

223

$22.555

$20.750

-

-

ChromeModa Solutions

Germany . 2,759 parts In-Stock

1+ parts

$23.015

100+ parts

$18.872

1k+ parts

-

10k+ parts

-

2,759

$23.015

$18.872

-

-

IDEA Electronic Components Group

UK . 1,306 parts In-Stock

1+ parts

$23.015

100+ parts

$21.864

1k+ parts

$20.714

10k+ parts

-

1,306

$23.015

$21.864

$20.714

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Corphita

USA . 3,302 parts In-Stock

1+ parts

$29.151

100+ parts

-

1k+ parts

-

10k+ parts

-

3,302

$29.151

-

-

-

Component Stockers USA

USA . 472 parts In-Stock

1+ parts

$32.810

100+ parts

$30.840

1k+ parts

-

10k+ parts

-

472

$32.810

$30.840

-

-

Corohmni

South Africa . 2,635 parts In-Stock

1+ parts

$33.820

100+ parts

-

1k+ parts

-

10k+ parts

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2,635

$33.820

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 23,545 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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23,545

-

-

-

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Microchip USA

USA . 3,441 parts In-Stock

1+ parts

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100+ parts

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3,441

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-

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Perfect Parts

USA . 10 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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10

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Overview

Experience the power of cutting-edge technology with the OMAPL138BZWTA3R by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-quality products that are perfect for a wide range of applications. From audio processing to industrial automation, this DSP offers unparalleled performance and efficiency. With its advanced features and innovative design, the OMAPL138BZWTA3R provides exceptional value and benefits to customers looking to elevate their projects to the next level. Choose Texas Instruments for reliability, versatility, and superior quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easier assembly and space-saving design.

Maximum Supply Voltage: 1.32 V

Operates efficiently within a safe voltage range.

Address Bus Width: 23

Wide address bus width allows for large memory addressing capabilities.

Package Shape: SQUARE

Square shape allows for easy placement on circuit boards.

Power Supplies (V): 1.2,1.8/3.3

Compatible with various power supply voltages for versatile applications.

No. of Terminals: 361

High number of terminals allow for connectivity to multiple components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style offers efficient layout and space-saving design.

Minimum Supply Voltage: 1.14 V

Operates efficiently at low voltage levels for power savings.

Terminal Finish: TIN SILVER COPPER

Terminal finish provides good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and connection.

Maximum Seated Height: 1.4 mm

Low seated height saves space on circuit boards.

Width: 16 mm

Compact width for efficient placement in electronic devices.

Boundary Scan: YES

Boundary scan feature for easier testing and debugging of the DSP.

External Data Bus Width: 16

Compatible with 16-bit external data buses for efficient data processing.

Maximum Clock Frequency: 30 MHz

Capable of high clock frequency for fast data processing.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for efficient soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust soldering.

Internal Bus Architecture: SINGLE

Single internal bus architecture for efficient data transfer and processing.

Length: 16 mm

Compact length for efficient placement in electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed specifically for digital signal processing and other peripheral functions.

Technology: CMOS

CMOS technology for low power consumption and high speed operation.

Terminal Form: BALL

Ball terminal form for efficient soldering and connection.

Nominal Supply Voltage: 1.2 V

Operates at a stable nominal supply voltage for reliable performance.

Terminal Pitch: 0.8 mm

Compact terminal pitch for efficient soldering and connection.

Format: FLOATING POINT

Floating point format for precise calculations and accuracy in signal processing.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 for safe handling and storage requirements.

Low Power Mode: YES

Low power mode for energy efficiency and extended battery life.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL138BZWTA3R attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL138BZWTA3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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