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MSP430F6778IPZ

Texas Instruments

MSP430F6778IPZ by Texas Instruments

MSP430F6778IPZ by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 16384 RAM bytes. Operating at up to 25 MHz, it supports I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring a low-profile design with a max seated height of 1.6 mm.

Median Price

$11.408

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,849 parts In-Stock

1+ parts

$11.408

100+ parts

$9.964

1k+ parts

$6.872

10k+ parts

-

4,849

$11.408

$9.964

$6.872

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,106 parts In-Stock

1+ parts

$10.838

100+ parts

-

1k+ parts

-

10k+ parts

-

3,106

$10.838

-

-

-

Nova Conductors

Japan . 31 parts In-Stock

1+ parts

$14.930

100+ parts

-

1k+ parts

-

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31

$14.930

-

-

-

Chip Stock

USA . 5,500 parts In-Stock

1+ parts

-

100+ parts

-

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5,500

-

-

-

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Vyrian

USA . 4,782 parts In-Stock

1+ parts

-

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-

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4,782

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,467 parts In-Stock

1+ parts

$9.700

100+ parts

-

1k+ parts

-

10k+ parts

-

4,467

$9.700

-

-

-

Corphita

USA . 4,069 parts In-Stock

1+ parts

$10.267

100+ parts

-

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10k+ parts

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4,069

$10.267

-

-

-

Corohmni

South Africa . 2,491 parts In-Stock

1+ parts

$14.930

100+ parts

-

1k+ parts

-

10k+ parts

-

2,491

$14.930

-

-

-

Continental Prestige Electronics

USA . 6,940 parts In-Stock

1+ parts

$14.930

100+ parts

-

1k+ parts

-

10k+ parts

$14.631

6,940

$14.930

-

-

$14.631

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$14.930

100+ parts

$14.631

1k+ parts

-

10k+ parts

-

1,000

$14.930

$14.631

-

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AZTECH Wire

Italy . 350 parts In-Stock

1+ parts

$19.330

100+ parts

-

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350

$19.330

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-

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Parana Technologies

USA . 677 parts In-Stock

1+ parts

$19.441

100+ parts

-

1k+ parts

$19.452

10k+ parts

-

677

$19.441

-

$19.452

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DigiPath Technology Company

USA . 1,199 parts In-Stock

1+ parts

$21.407

100+ parts

-

1k+ parts

-

10k+ parts

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1,199

$21.407

-

-

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ChromeModa Solutions

Germany . 3,660 parts In-Stock

1+ parts

$21.844

100+ parts

$17.912

1k+ parts

-

10k+ parts

-

3,660

$21.844

$17.912

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IDEA Electronic Components Group

UK . 2,334 parts In-Stock

1+ parts

$21.844

100+ parts

$20.752

1k+ parts

$19.660

10k+ parts

-

2,334

$21.844

$20.752

$19.660

-

Microchip USA

USA . 1,899 parts In-Stock

1+ parts

$31.680

100+ parts

$31.220

1k+ parts

$31.000

10k+ parts

$30.770

1,899

$31.680

$31.220

$31.000

$30.770

Argo Parts USA

USA . 1,138 parts In-Stock

1+ parts

-

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1,138

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-

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Perfect Parts

USA . 140 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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140

-

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Overview

Discover the power and reliability of the MSP430F6778IPZ by Texas Instruments, a cutting-edge microprocessor circuit designed for a wide range of applications. With Texas Instruments' trusted reputation for quality and innovation, this product offers unparalleled performance and efficiency. Whether you're working on IoT devices, consumer electronics, or industrial automation, this versatile IC provides the speed, accuracy, and flexibility you need to bring your projects to life. Experience the difference with the MSP430F6778IPZ and unlock endless possibilities for your next design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount design allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing flexibility for different power sources.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, making it ideal for compact designs.

Bit Size: 16

The 16-bit processing capability provides enhanced performance and efficiency for demanding tasks.

Power Supplies (V): 2/3.3

With multiple voltage options, this product can be compatible with a variety of power sources, offering versatility in different setups.

No. of Terminals: 100

The high number of terminals allows for versatile connectivity options, enabling seamless integration with other components in a system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact and low-profile design, which is essential for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures efficient power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for industrial environments with demanding temperature conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6778IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6778IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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