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MSP430F6749IPEU

Texas Instruments

MSP430F6749IPEU by Texas Instruments

MSP430F6749IPEU by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. Operating at up to 25 MHz, it has a supply voltage range of 1.8-3.6 V, making it ideal for industrial applications requiring low power consumption and high clock frequency. Its compact FLATPACK package with a seated height of 1.6 mm suits space-constrained designs needing efficient processing capabilities.

Median Price

$11.434

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 758 parts In-Stock

1+ parts

$11.842

100+ parts

$10.344

1k+ parts

$7.134

10k+ parts

-

758

$11.842

$10.344

$7.134

-

Rochester

USA . 67 parts In-Stock

1+ parts

-

100+ parts

$8.910

1k+ parts

$7.970

10k+ parts

$7.500

67

-

$8.910

$7.970

$7.500

DigiKey

USA . 67 parts In-Stock

1+ parts

-

100+ parts

$11.730

1k+ parts

-

10k+ parts

-

67

-

$11.730

-

-

Verical

USA . 67 parts In-Stock

1+ parts

-

100+ parts

$11.137

1k+ parts

$9.963

10k+ parts

$9.375

67

-

$11.137

$9.963

$9.375

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,026 parts In-Stock

1+ parts

$9.414

100+ parts

-

1k+ parts

-

10k+ parts

-

4,026

$9.414

-

-

-

Vyrian

USA . 3,429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,429

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,686 parts In-Stock

1+ parts

$8.919

100+ parts

-

1k+ parts

-

10k+ parts

-

2,686

$8.919

-

-

-

Corohmni

South Africa . 1,061 parts In-Stock

1+ parts

$10.910

100+ parts

-

1k+ parts

-

10k+ parts

-

1,061

$10.910

-

-

-

Microchip USA

USA . 1,871 parts In-Stock

1+ parts

$32.060

100+ parts

$31.600

1k+ parts

$31.370

10k+ parts

$31.140

1,871

$32.060

$31.600

$31.370

$31.140

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$39.380

100+ parts

$35.836

1k+ parts

$32.292

10k+ parts

-

2,000

$39.380

$35.836

$32.292

-

Parana Technologies

USA . 582 parts In-Stock

1+ parts

$64.259

100+ parts

-

1k+ parts

-

10k+ parts

-

582

$64.259

-

-

-

DigiPath Technology Company

USA . 1,573 parts In-Stock

1+ parts

$70.757

100+ parts

$65.096

1k+ parts

-

10k+ parts

-

1,573

$70.757

$65.096

-

-

ChromeModa Solutions

Germany . 3,512 parts In-Stock

1+ parts

$72.201

100+ parts

$59.205

1k+ parts

-

10k+ parts

-

3,512

$72.201

$59.205

-

-

IDEA Electronic Components Group

UK . 147 parts In-Stock

1+ parts

$72.201

100+ parts

$68.591

1k+ parts

$64.981

10k+ parts

-

147

$72.201

$68.591

$64.981

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Unlock the power of innovation with the MSP430F6749IPEU by Texas Instruments. This cutting-edge microprocessor circuit offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. With advanced technology and top-notch quality, Texas Instruments delivers a product that exceeds expectations. Whether you're designing IoT devices, industrial controls, or consumer electronics, this versatile solution provides the value, benefits, and advantages you need to take your projects to the next level. Embrace the future of technology with the MSP430F6749IPEU.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the product.

Surface Mount: YES

Enables easy and secure installation on PCBs for efficient integration.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltage, making it versatile for different applications.

Package Shape: RECTANGULAR

Allows for efficient use of space on the PCB.

Bit Size: 16

Provides sufficient processing power for handling complex tasks.

Power Supplies (V): 2/3.3

Offers flexibility in power supply options.

No. of Terminals: 128

Facilitates connectivity with other components for seamless communication.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact design and efficient PCB layout.

Minimum Supply Voltage: 1.8 V

Allows for operation in low power scenarios.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

CPU Family: MSP430

Known for low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures good conductivity and resistance to corrosion.

ADC Channels: YES

Enables analog-to-digital conversion for sensor interfacing.

Terminal Position: QUAD

Provides multiple connection points for enhanced connectivity.

ROM Words: 524288

Ample memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Allows for a low-profile design.

RAM Words: 32

Sufficient random access memory for temporary data storage.

Width: 14 mm

Compact size for space-constrained applications.

Maximum Clock Frequency: 25 MHz

Provides fast processing speed for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes.

Length: 20 mm

Optimal size for compact electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Provides additional functionality for enhanced system capabilities.

RAM Bytes: 32768

Sufficient memory space for data storage and manipulation.

Technology: CMOS

Known for low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates secure soldering and connectivity.

Maximum Supply Current: 11.75 mA

Efficient power consumption for extended battery life.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance.

ROM Programmability: FLASH

Allows for reprogramming of the ROM for firmware updates.

Bus Compatibility: I2C; SPI; UART

Supports various communication protocols for flexible connectivity.

Terminal Pitch: 0.5 mm

Fine pitch for high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate moisture sensitivity.

Speed: 25 rpm

Capable of processing data at a fast rate for quick response times.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6749IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6749IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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