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MSP430F67481AIPZR

Texas Instruments

MSP430F67481AIPZR by Texas Instruments

MSP430F67481AIPZR by Texas Instruments features 16-bit CPU, 524288 ROM words, and 6-Ch 10-Bit ADC channels. Ideal for industrial applications requiring low power consumption and high performance with peripherals like BOR, RTC, and DMA. Operates b/w -40 to 85 °C temperature range.

Median Price

$9.054

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,950 parts In-Stock

1+ parts

$9.054

100+ parts

$7.908

1k+ parts

$5.454

10k+ parts

-

2,950

$9.054

$7.908

$5.454

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,654 parts In-Stock

1+ parts

$8.601

100+ parts

-

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-

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1,654

$8.601

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Vyrian

USA . 6,963 parts In-Stock

1+ parts

-

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-

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6,963

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,070 parts In-Stock

1+ parts

$8.149

100+ parts

-

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-

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4,070

$8.149

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Corohmni

South Africa . 409 parts In-Stock

1+ parts

$15.575

100+ parts

-

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409

$15.575

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AZTECH Wire

Italy . 932 parts In-Stock

1+ parts

$16.140

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932

$16.140

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Microchip USA

USA . 1,313 parts In-Stock

1+ parts

$20.510

100+ parts

$20.220

1k+ parts

$20.070

10k+ parts

$19.930

1,313

$20.510

$20.220

$20.070

$19.930

Parana Technologies

USA . 1,561 parts In-Stock

1+ parts

$23.596

100+ parts

-

1k+ parts

$24.227

10k+ parts

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1,561

$23.596

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$24.227

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DigiPath Technology Company

USA . 2,136 parts In-Stock

1+ parts

$25.982

100+ parts

$23.903

1k+ parts

-

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2,136

$25.982

$23.903

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ChromeModa Solutions

Germany . 375 parts In-Stock

1+ parts

$26.512

100+ parts

$21.740

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375

$26.512

$21.740

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IDEA Electronic Components Group

UK . 217 parts In-Stock

1+ parts

$26.512

100+ parts

$25.186

1k+ parts

$23.861

10k+ parts

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217

$26.512

$25.186

$23.861

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Overview

Enhance your electronic designs with the Texas Instruments MSP430F67481AIPZR, a top-of-the-line microprocessor circuit that offers unparalleled quality and performance. Manufactured by the industry leader Texas Instruments, this innovative product is perfect for a wide range of applications, from consumer electronics to industrial automation. With its advanced features like multiple ADC channels, DMA channels, and PWM channels, this microprocessor provides exceptional value and flexibility to customers looking to create cutting-edge products. Unlock the full potential of your projects with the MSP430F67481AIPZR and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the ICs, ensuring a longer lifespan for the product.

Surface Mount: YES

Can be easily integrated onto circuit boards, making the assembly process more efficient and cost-effective.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply requirements, accommodating various voltage levels for different applications.

Package Shape: SQUARE

Enables efficient use of space on circuit boards, maximizing the potential for compact designs.

Bit Size: 16

Offers a good balance between processing power and complexity, suitable for a wide range of applications.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the IC to interface with sensors and other analog devices.

DMA Channels: YES

Provides Direct Memory Access channels for efficient data transfer and processing, increasing overall system performance.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology, which is known for its low power consumption and high speed operation.

PWM Channels: YES

Supports Pulse-Width Modulation channels for precise control of analog signals, useful in applications such as motor control and power management.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Offers a variety of communication interfaces, allowing the IC to easily communicate with different devices in a system.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67481AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67481AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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