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DM385AAARD21F

Texas Instruments

DM385AAARD21F by Texas Instruments

The Texas Instruments DM385AAARD21F microprocessor features 32-bit architecture, 28-bit address bus width, and integrated cache. Ideal for industrial applications requiring high processing speeds up to 30 MHz with low power mode support. Package style: Grid Array, Terminal Finish: Tin Silver Copper, Technology: CMOS.

Median Price

$62.180

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 35 parts In-Stock

1+ parts

$62.180

100+ parts

-

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35

$62.180

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Distributors (In-Stock)

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Vyrian

USA . 7,156 parts In-Stock

1+ parts

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7,156

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Chip Stock

USA . 2,510 parts In-Stock

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2,510

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Digiode

USA . 377 parts In-Stock

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377

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Distributors (Availability)

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Native Components

USA . 82 parts In-Stock

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$6.580

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-

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82

$6.580

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Parana Technologies

USA . 1,462 parts In-Stock

1+ parts

$19.492

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-

1k+ parts

$19.497

10k+ parts

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1,462

$19.492

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$19.497

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DigiPath Technology Company

USA . 1,760 parts In-Stock

1+ parts

$21.463

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1,760

$21.463

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ChromeModa Solutions

Germany . 1,800 parts In-Stock

1+ parts

$21.901

100+ parts

$17.959

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1,800

$21.901

$17.959

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IDEA Electronic Components Group

UK . 433 parts In-Stock

1+ parts

$21.901

100+ parts

$20.806

1k+ parts

$19.711

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433

$21.901

$20.806

$19.711

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Corohmni

South Africa . 27 parts In-Stock

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$30.795

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27

$30.795

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Microchip USA

USA . 2,129 parts In-Stock

1+ parts

$54.920

100+ parts

$54.130

1k+ parts

$53.740

10k+ parts

$53.350

2,129

$54.920

$54.130

$53.740

$53.350

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$58.502

100+ parts

$53.237

1k+ parts

$47.972

10k+ parts

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1,000

$58.502

$53.237

$47.972

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 1,465 parts In-Stock

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Northwest PG Solutions

USA . 630 parts In-Stock

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$6.448

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630

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$6.448

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Perfect Parts

USA . 202 parts In-Stock

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Kepictronics

USA . 42 parts In-Stock

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Overview

Experience unmatched performance and reliability with the Texas Instruments DM385AAARD21F microprocessor. Crafted by a trusted manufacturer, this cutting-edge technology offers seamless integration, advanced features, and high-speed processing capabilities. Ideal for a wide range of applications, this product delivers exceptional value, efficiency, and versatility to meet all your computing needs. Upgrade to the DM385AAARD21F and elevate your projects to the next level of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, making it suitable for various applications.

Integrated Cache: YES

Having integrated cache helps in reducing memory access times and improving overall performance.

Maximum Supply Voltage: 1.42 V

Allows for flexible power supply options while ensuring safe operation within specified limits.

Address Bus Width: 28

The wider address bus allows for accessing a larger memory space efficiently.

Package Shape: SQUARE

Square package shape enables easy and uniform placement on circuit boards.

Bit Size: 32

32-bit architecture enables handling of larger data sets and enhances processing capabilities.

Power Supplies (V): 1.14/1.42

Supports a range of power supply voltages for versatility in different operating conditions.

No. of Terminals: 609

Having a high number of terminals allows for a greater connectivity and integration with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with efficient heat dissipation and ease of mounting.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, expanding the range of applications where it can be used.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature, the microprocessor can withstand heat-intensive tasks and environments.

RAM Words: 8192

Ample RAM capacity allows for efficient multitasking and handling of large datasets.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor enables fast and efficient processing of instructions, enhancing overall performance.

Maximum Clock Frequency: 30 MHz

Capable of high clock speeds, providing quick execution of operations and tasks.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the microprocessor can be quickly and effectively soldered onto the circuit board.

Technical Specifications

Microprocessors DM385AAARD21F attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

609

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA609,31X31,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.14/1.42

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.32 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM385AAARD21F Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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