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DM388AAARD11

Texas Instruments

DM388AAARD11 by Texas Instruments

The Texas Instruments DM388AAARD11 microprocessor features 32-bit architecture, 1.42V max supply voltage, and 609 terminals. With a clock frequency of up to 30MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The integrated cache and low power mode make it suitable for embedded systems needing efficient data handling at temperatures ranging from -40°C to 95°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,451 parts In-Stock

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7,451

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Digiode

USA . 2,481 parts In-Stock

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2,481

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Distributors (Availability)

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One Stop Electronics

USA . 1,588 parts In-Stock

1+ parts

$11.000

100+ parts

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1,588

$11.000

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AZTECH Wire

Italy . 449 parts In-Stock

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$14.524

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449

$14.524

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Advanced Electronics

New Zealand . 45 parts In-Stock

1+ parts

$49.781

100+ parts

$45.301

1k+ parts

$40.820

10k+ parts

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45

$49.781

$45.301

$40.820

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Parana Technologies

USA . 2,076 parts In-Stock

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$76.793

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2,076

$76.793

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DigiPath Technology Company

USA . 1,383 parts In-Stock

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$84.558

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1,383

$84.558

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IDEA Electronic Components Group

UK . 441 parts In-Stock

1+ parts

$86.284

100+ parts

$81.970

1k+ parts

$77.656

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441

$86.284

$81.970

$77.656

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ChromeModa Solutions

Germany . 325 parts In-Stock

1+ parts

$86.284

100+ parts

$70.753

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325

$86.284

$70.753

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Microchip USA

USA . 1,065 parts In-Stock

1+ parts

$127.490

100+ parts

$125.270

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$124.160

10k+ parts

$123.050

1,065

$127.490

$125.270

$124.160

$123.050

Corphita

USA . 4,669 parts In-Stock

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4,669

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Northwest PG Solutions

USA . 2,049 parts In-Stock

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2,049

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Native Components

USA . 557 parts In-Stock

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557

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Overview

Experience unparalleled performance and reliability with the Texas Instruments DM388AAARD11 Microprocessor. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology for a wide range of applications. This microprocessor boasts integrated cache, low power mode, and a high-speed clock frequency of 30 MHz. With a wide address bus width and extensive RAM words, this product offers exceptional value and efficiency for your projects. Trust Texas Instruments to provide the quality and innovation you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor components, ensuring longevity and reliability.

Integrated Cache: YES

Having integrated cache helps in improving the overall performance of the microprocessor by reducing the latency in accessing frequently used data.

Maximum Supply Voltage: 1.42 V

Allows for a higher supply voltage, which can enhance the processing speed and efficiency of the microprocessor.

Address Bus Width: 28

A wider address bus width allows the microprocessor to access a larger memory space, leading to better performance in handling complex tasks.

Bit Size: 32

A 32-bit architecture enables the microprocessor to handle larger chunks of data at a time, improving computational capabilities.

Maximum Clock Frequency: 30 MHz

With a higher clock frequency, the microprocessor can execute instructions at a faster rate, enhancing overall performance.

Technical Specifications

Microprocessors DM388AAARD11 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

609

On Chip Data RAM Width:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

655360

Maximum Seated Height:

1.32 mm

Speed:

970 rpm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM388AAARD11 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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