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DM385AAAR01

Texas Instruments

DM385AAAR01 by Texas Instruments

The Texas Instruments DM385AAAR01 microprocessor features 32-bit architecture, 28-bit address bus width, and integrated cache. Ideal for applications requiring low power consumption and high processing speed, with a max clock frequency of 30 MHz. Suitable for use in various electronic devices due to its compact size and advanced CMOS technology.

Median Price

$38.835

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 65 parts In-Stock

1+ parts

$30.560

100+ parts

$29.980

1k+ parts

$29.970

10k+ parts

$29.940

65

$30.560

$29.980

$29.970

$29.940

DigiKey

USA . 12 parts In-Stock

1+ parts

$47.110

100+ parts

-

1k+ parts

-

10k+ parts

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12

$47.110

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-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,044 parts In-Stock

1+ parts

$29.032

100+ parts

-

1k+ parts

-

10k+ parts

-

1,044

$29.032

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-

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Vyrian

USA . 7,419 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,419

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 252 parts In-Stock

1+ parts

$5.910

100+ parts

-

1k+ parts

-

10k+ parts

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252

$5.910

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-

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Corphita

USA . 3,161 parts In-Stock

1+ parts

$27.504

100+ parts

-

1k+ parts

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10k+ parts

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3,161

$27.504

-

-

-

Microchip USA

USA . 1,027 parts In-Stock

1+ parts

$55.000

100+ parts

$54.210

1k+ parts

$53.820

10k+ parts

$53.430

1,027

$55.000

$54.210

$53.820

$53.430

Parana Technologies

USA . 1,007 parts In-Stock

1+ parts

$60.055

100+ parts

-

1k+ parts

-

10k+ parts

-

1,007

$60.055

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-

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DigiPath Technology Company

USA . 1,862 parts In-Stock

1+ parts

$66.128

100+ parts

$60.838

1k+ parts

-

10k+ parts

-

1,862

$66.128

$60.838

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ChromeModa Solutions

Germany . 6,578 parts In-Stock

1+ parts

$67.478

100+ parts

$55.332

1k+ parts

-

10k+ parts

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6,578

$67.478

$55.332

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IDEA Electronic Components Group

UK . 416 parts In-Stock

1+ parts

$67.478

100+ parts

$64.104

1k+ parts

$60.730

10k+ parts

-

416

$67.478

$64.104

$60.730

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10,000

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Northwest PG Solutions

USA . 808 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$5.792

10k+ parts

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808

-

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$5.792

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Overview

Unlock the power of cutting-edge technology with the DM385AAAR01 by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This microprocessor is perfect for a wide range of applications, offering seamless integration and impressive performance. With integrated cache and low power mode, this product delivers unmatched value and efficiency to customers. Elevate your projects with the DM385AAAR01 and experience the difference that Texas Instruments can make in your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microprocessor lightweight and durable, ensuring longevity and ease of handling.

Integrated Cache: YES

Having integrated cache enhances the performance of the microprocessor by reducing memory access times and improving overall efficiency.

Surface Mount: YES

Being surface mountable allows for easy and secure installation of the microprocessor onto a circuit board, making it convenient for assembly and maintenance.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26V ensures that the microprocessor operates within safe voltage limits, preventing any damage due to overvoltage.

Address Bus Width: 28

With a wide address bus width of 28, the microprocessor can effectively handle large amounts of memory addresses, enabling efficient data processing.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making it suitable for devices with limited space availability.

Bit Size: 32

A bit size of 32 allows the microprocessor to process 32 bits of data in a single operation, enhancing its speed and performance capabilities.

Power Supplies (V): 1.14/1.42

The microprocessor can operate within a range of power supplies, providing flexibility in different voltage environments for various applications.

No. of Terminals: 609

Having 609 terminals allows for multiple connections and interfaces, enabling the microprocessor to communicate efficiently with other components in a system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch offers a high-density packaging solution, saving space and enhancing thermal performance.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14V ensures that the microprocessor operates reliably even under low voltage conditions, improving system stability.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature of 95°C, the microprocessor can withstand elevated temperatures, making it suitable for demanding operating environments.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures reliable performance in cold environments, expanding the range of applications for the microprocessor.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance, ensuring stable electrical connections for optimal performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy installation and secure connections, enhancing the overall reliability and functionality of the microprocessor.

Maximum Seated Height: 1.32 mm

The low maximum seated height of 1.32mm allows for a slim profile, making the microprocessor suitable for compact electronic devices and space-constrained applications.

RAM Words: 8192

With 8192 RAM words, the microprocessor can efficiently store and access a large amount of data, improving multitasking capabilities and overall performance.

Width: 16 mm

The narrow width of 16mm allows for a space-efficient design, enabling the microprocessor to be integrated easily into various electronic systems.

Boundary Scan: YES

The presence of boundary scan capability enables easier testing and debugging of the microprocessor, ensuring higher reliability and faster time-to-market for products.

External Data Bus Width: 16

An external data bus width of 16 enables fast data transfer between the microprocessor and external devices, improving overall system performance and efficiency.

Maximum Clock Frequency: 30 MHz

Operating at a maximum clock frequency of 30MHz, the microprocessor can handle high-speed processing tasks, delivering rapid data processing speeds for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microprocessor can withstand reflow soldering processes without compromising its performance or reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering of the microprocessor onto the circuit board, guaranteeing secure connections and stable operation.

Length: 16 mm

The compact length of 16mm contributes to a space-saving design, allowing the microprocessor to be integrated into smaller electronic devices without compromising performance.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers simplified and efficient instruction set architecture, enabling faster data processing and improved performance for tasks.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable for a variety of applications.

Terminal Form: BALL

The ball terminal form facilitates secure soldering onto the circuit board, ensuring reliable electrical connections and stable operation of the microprocessor.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage of 1.2V ensures consistent and stable performance of the microprocessor, optimizing power efficiency and system reliability.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5mm, the microprocessor allows for densely packed terminals, enabling high-speed data transfer and efficient signal transmission.

Format: FLOATING POINT

Supporting floating-point format enhances the microprocessor's capability to perform complex mathematical calculations accurately, making it suitable for scientific and computational tasks.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates a moderate level of sensitivity to moisture, requiring appropriate handling and storage to prevent damage during assembly or operation.

Speed: 720 rpm

Operating at a speed of 720 revolutions per minute (rpm) allows the microprocessor to deliver fast processing and efficient data handling for high-performance applications.

Low Power Mode: YES

The availability of a low power mode ensures energy-efficient operation of the microprocessor, reducing power consumption during idle or low-demand situations for optimized performance.

Technical Specifications

Microprocessors DM385AAAR01 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

609

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA609,31X31,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.14/1.42

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.32 mm

Speed:

720 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM385AAAR01 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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