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DM385AAAR21F

Texas Instruments

DM385AAAR21F by Texas Instruments

The Texas Instruments DM385AAAR21F microprocessor features 32-bit architecture, 28-bit address bus width, and integrated cache. Ideal for low power applications with a max clock frequency of 30 MHz. Package style: Grid Array, Low Profile, Fine Pitch.

Median Price

$54.180

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 39 parts In-Stock

1+ parts

$54.180

100+ parts

$45.200

1k+ parts

$44.290

10k+ parts

$43.640

39

$54.180

$45.200

$44.290

$43.640

Rochester

USA . 64 parts In-Stock

1+ parts

-

100+ parts

$44.820

1k+ parts

$40.100

10k+ parts

$37.740

64

-

$44.820

$40.100

$37.740

DigiKey

USA . 64 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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64

-

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-

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Verical

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$56.025

1k+ parts

$50.125

10k+ parts

$47.175

60

-

$56.025

$50.125

$47.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,495 parts In-Stock

1+ parts

$39.548

100+ parts

-

1k+ parts

-

10k+ parts

-

1,495

$39.548

-

-

-

DigiKey Marketplace

USA . 94 parts In-Stock

1+ parts

$43.300

100+ parts

-

1k+ parts

-

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-

94

$43.300

-

-

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Vyrian

USA . 6,035 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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6,035

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,284 parts In-Stock

1+ parts

$23.240

100+ parts

$23.100

1k+ parts

$23.020

10k+ parts

$22.950

1,284

$23.240

$23.100

$23.020

$22.950

Corphita

USA . 118 parts In-Stock

1+ parts

$37.467

100+ parts

-

1k+ parts

-

10k+ parts

-

118

$37.467

-

-

-

Corohmni

South Africa . 194 parts In-Stock

1+ parts

$45.797

100+ parts

-

1k+ parts

-

10k+ parts

-

194

$45.797

-

-

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Parana Technologies

USA . 408 parts In-Stock

1+ parts

$47.813

100+ parts

$4,440.123

1k+ parts

$43.031

10k+ parts

-

408

$47.813

$4,440.123

$43.031

-

Advanced Electronics

New Zealand . 92 parts In-Stock

1+ parts

$48.059

100+ parts

$43.734

1k+ parts

$39.408

10k+ parts

-

92

$48.059

$43.734

$39.408

-

DigiPath Technology Company

USA . 1,377 parts In-Stock

1+ parts

$52.648

100+ parts

$48.436

1k+ parts

-

10k+ parts

-

1,377

$52.648

$48.436

-

-

IDEA Electronic Components Group

UK . 1,668 parts In-Stock

1+ parts

$53.722

100+ parts

$51.036

1k+ parts

$48.350

10k+ parts

-

1,668

$53.722

$51.036

$48.350

-

ChromeModa Solutions

Germany . 1,599 parts In-Stock

1+ parts

$53.722

100+ parts

$44.052

1k+ parts

-

10k+ parts

-

1,599

$53.722

$44.052

-

-

A-Z Elektronik GmbH

Germany . 5,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,096

-

-

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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100+ parts

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3,500

-

-

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Alle Elektronik GmbH

Germany . 3,397 parts In-Stock

1+ parts

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100+ parts

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3,397

-

-

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

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3,000

-

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Native Components

USA . 616 parts In-Stock

1+ parts

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616

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Northwest PG Solutions

USA . 484 parts In-Stock

1+ parts

-

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484

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Overview

Experience unparalleled performance and reliability with the DM385AAAR21F by Texas Instruments, a cutting-edge microprocessor designed for a wide range of applications. Crafted with precision by a trusted manufacturer, this advanced chip boasts integrated cache and low power mode capabilities, ensuring optimal efficiency and speed. With a sleek package body material and high-quality terminal finish, this microprocessor guarantees seamless operation and longevity. Elevate your projects with the superior technology and value that the DM385AAAR21F brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage during installation and use.

Integrated Cache: YES

Having integrated cache helps in improving the performance of the microprocessor by reducing the access time to frequently used data and instructions.

Surface Mount: YES

The surface mount design allows for easy and secure installation on a circuit board, making it suitable for compact and densely populated electronic devices.

Maximum Supply Voltage: 1.42 V

Operating within the specified voltage range ensures the stability and reliability of the microprocessor, preventing potential damage from overvoltage.

Address Bus Width: 28

A wider address bus allows for larger memory addressing capabilities, enabling the microprocessor to access and process more data efficiently.

Package Shape: SQUARE

The square shape provides a consistent and compact form factor, allowing for easier integration into various electronic systems and layouts.

Bit Size: 32

The 32-bit architecture enables the microprocessor to handle larger chunks of data in a single instruction cycle, enhancing its overall processing speed and efficiency.

Power Supplies (V): 1.14/1.42

Having multiple power supply options allows flexibility in voltage regulation, catering to different power requirements and optimizing energy efficiency.

No. of Terminals: 609

The high number of terminals provides ample connectivity options for interfacing with various peripherals and components, expanding the functionality of the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array layout with low profile and fine pitch design enhances signal integrity, reduces crosstalk, and enables high-density packaging for space-constrained applications.

Minimum Supply Voltage: 1.28 V

The specified minimum supply voltage ensures operational stability and performance under low voltage conditions, safeguarding the microprocessor from potential malfunctions.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature tolerance allows the microprocessor to operate in a wide range of environmental conditions without risk of overheating or performance degradation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making the microprocessor suitable for a variety of application settings.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity, corrosion resistance, and solderability, ensuring robust electrical connections and long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting on the circuit board, optimizing signal transmission and heat dissipation for improved overall performance.

Maximum Seated Height: 1.32 mm

The low maximum seated height allows for a compact and low-profile design, reducing the overall space requirements and enabling installation in slim electronic devices.

RAM Words: 8192

With a higher number of RAM words, the microprocessor can efficiently store and manipulate data in memory, enhancing its multitasking and data processing capabilities.

Width: 16 mm

The compact width dimension of 16mm enables the microprocessor to be compatible with various standard board sizes and form factors, offering versatility in system integration.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the microprocessor during manufacturing and in-field operations, ensuring higher quality and reliability.

External Data Bus Width: 16

The 16-bit external data bus width enables faster data transfer between the microprocessor and external devices, enhancing overall system performance and responsiveness.

Maximum Clock Frequency: 30 MHz

Operating at a maximum clock frequency of 30 MHz, the microprocessor can execute instructions and process data at a high speed, meeting the demands of performance-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature ensures proper solder reflow process for secure and reliable connections, maintaining the integrity of the microprocessor.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microprocessor can withstand high-temperature soldering processes without damage, ensuring robust assembly and long-term reliability.

Length: 16 mm

The compact length dimension of 16mm contributes to a space-efficient design, suitable for small form factor devices and applications with limited spatial constraints.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it is optimized for efficient instruction execution, offering high performance and power efficiency for a wide range of computing tasks.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and reliable operation, making the microprocessor suitable for battery-powered and portable devices.

Terminal Form: BALL

The ball terminal form facilitates reliable and secure solder connections, ensuring proper electrical contact and signal transmission in demanding operating conditions.

Nominal Supply Voltage: 1.35 V

Operating at a nominal supply voltage of 1.35V ensures stable performance and optimal power efficiency, meeting the power requirements of the microprocessor.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting on the PCB, enabling compact and space-saving designs in electronic systems with limited board space.

Format: FLOATING POINT

The floating-point format enables efficient processing of numerical calculations involving decimal numbers, enhancing the computational capabilities and accuracy of the microprocessor.

Moisture Sensitivity Level (MSL): 3

Having a MSL of 3 indicates a moderate level of moisture sensitivity, requiring proper handling and storage to prevent moisture-induced damage during assembly and operation.

Speed: 1000 rpm

With a speed of 1000 rpm, the microprocessor can execute instructions and process data at a rapid rate, delivering high performance and responsiveness for various computing tasks.

Low Power Mode: YES

The low power mode feature allows the microprocessor to operate in a power-efficient state when performance demands are lower, conserving energy and extending battery life in portable devices.

Technical Specifications

Microprocessors DM385AAAR21F attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

609

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA609,31X31,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.14/1.42

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.32 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM385AAAR21F Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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