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DM383AAAR01

Texas Instruments

DM383AAAR01 by Texas Instruments

The Texas Instruments DM383AAAR01 microprocessor features a 32-bit architecture with 27-bit address bus width and 16-bit external data bus width. With a max clock frequency of 30 MHz, it is suitable for low-power applications requiring high-speed processing. This CMOS technology-based processor comes in a grid array package style with 609 terminals, making it ideal for compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,002 parts In-Stock

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Digiode

USA . 4,910 parts In-Stock

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4,910

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Distributors (Availability)

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AZTECH Wire

Italy . 341 parts In-Stock

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$6.193

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341

$6.193

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$10.123

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$10.021

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$9.616

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$10.123

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Native Components

USA . 909 parts In-Stock

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$15.720

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909

$15.720

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Northwest PG Solutions

USA . 606 parts In-Stock

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$17.292

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$15.562

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606

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One Stop Electronics

USA . 361 parts In-Stock

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$26.000

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361

$26.000

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Parana Technologies

USA . 1,541 parts In-Stock

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$36.313

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$3,372.203

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$32.682

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1,541

$36.313

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DigiPath Technology Company

USA . 1,842 parts In-Stock

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$39.985

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ChromeModa Solutions

Germany . 5,266 parts In-Stock

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$40.801

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$33.457

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$40.801

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IDEA Electronic Components Group

UK . 1,504 parts In-Stock

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$40.801

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$38.761

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$36.721

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1,504

$40.801

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$36.721

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Corphita

USA . 2,777 parts In-Stock

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Microchip USA

USA . 182 parts In-Stock

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Overview

Discover the power of the Texas Instruments DM383AAAR01 microprocessor, a cutting-edge technology that offers unparalleled performance and reliability. As a renowned manufacturer in the industry, Texas Instruments delivers top-quality products that meet the highest standards. Ideal for a wide range of applications, this microprocessor provides seamless integration and efficient operation. With its advanced features and innovative design, customers can expect superior value and exceptional benefits. Upgrade your system today with the DM383AAAR01 and experience the advantages firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost, making the product more affordable without compromising on quality.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance of the microprocessor by reducing access time to frequently used data and instructions.

Surface Mount: YES

Surface mount technology makes the installation of the microprocessor easier and more reliable, increasing the efficiency of the product.

Maximum Supply Voltage: 1.26 V

This high maximum supply voltage allows for stable operation of the microprocessor even under heavy workloads, ensuring smooth performance.

Address Bus Width: 27

A wider address bus width means the microprocessor can access a larger range of memory locations, which is essential for handling complex tasks efficiently.

Package Shape: SQUARE

The square package shape allows for more uniform distribution of components within the microprocessor, improving heat dissipation and overall reliability.

Bit Size: 32

With a 32-bit architecture, this microprocessor can handle larger chunks of data at a time, enhancing processing speed and efficiency.

No. of Terminals: 609

Having a high number of terminals enables the microprocessor to establish connections with other components effectively, ensuring seamless communication.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with high-density integration, making it suitable for applications where space is limited.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and extending the battery life of devices powered by this microprocessor.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the microprocessor.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation process and offers better thermal management, enhancing the overall reliability of the microprocessor.

Maximum Seated Height: 1.32 mm

The low maximum seated height allows for a more compact and slim design, making it suitable for applications where space is at a premium.

Width: 16 mm

The compact width of the microprocessor makes it versatile and easy to integrate into a wide range of devices without compromising on performance.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microprocessor, ensuring high reliability and quick identification of potential issues.

External Data Bus Width: 16

A wider external data bus width enables faster data transfer between the microprocessor and other components, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency allows for fast data processing and efficient performance of the microprocessor, making it suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

This spec ensures that the microprocessor can withstand high temperatures during reflow soldering without being damaged, ensuring reliability during manufacturing.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this microprocessor can endure the rigors of the manufacturing process, ensuring consistent quality and reliability.

Length: 16 mm

The compact length of the microprocessor makes it suitable for applications where space is limited, without compromising on performance.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture enables the microprocessor to execute instructions at a faster rate, improving overall system performance and efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor suitable for battery-powered devices and noise-sensitive applications.

Terminal Form: BALL

Ball terminal form facilitates easy installation and reliable connections, ensuring smooth operation and longevity of the microprocessor.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable operating voltage for the microprocessor, ensuring consistent performance and reliability.

Terminal Pitch: 0.5 mm

With a small terminal pitch, this microprocessor offers high-density integration and efficient routing, making it suitable for compact and complex applications.

Format: FLOATING POINT

Floating-point format allows the microprocessor to perform complex mathematical calculations accurately and efficiently, making it suitable for scientific and computational tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this microprocessor can withstand moderate levels of moisture exposure, making it suitable for a wide range of operating environments.

Speed: 720 rpm

With a high speed of 720 rpm, this microprocessor can provide fast and efficient data processing, making it suitable for high-performance applications.

Low Power Mode: YES

The low power mode option helps in reducing power consumption when the microprocessor is idle or under light processing load, extending battery life and efficiency.

Technical Specifications

Microprocessors DM383AAAR01 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

27

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

609

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.32 mm

Speed:

720 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM383AAAR01 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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