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DM388AAAR01

Texas Instruments

DM388AAAR01 by Texas Instruments

The Texas Instruments DM388AAAR01 microprocessor features a 32-bit architecture with 16mm width and length, operating at a max clock frequency of 30MHz. With integrated cache and low power mode, it is suitable for applications requiring high-speed processing in compact devices. The package style includes a grid array with 609 terminals on a square shape, making it ideal for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,074 parts In-Stock

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Digiode

USA . 721 parts In-Stock

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721

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Distributors (Availability)

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Native Components

USA . 645 parts In-Stock

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$7.349

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645

$7.349

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AZTECH Wire

Italy . 489 parts In-Stock

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$8.002

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$8.002

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One Stop Electronics

USA . 728 parts In-Stock

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$32.000

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728

$32.000

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Parana Technologies

USA . 487 parts In-Stock

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$54.250

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487

$54.250

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DigiPath Technology Company

USA . 945 parts In-Stock

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$59.736

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945

$59.736

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ChromeModa Solutions

Germany . 5,783 parts In-Stock

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$60.955

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$49.983

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5,783

$60.955

$49.983

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IDEA Electronic Components Group

UK . 874 parts In-Stock

1+ parts

$60.955

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$57.907

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$54.860

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874

$60.955

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$54.860

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Corphita

USA . 3,485 parts In-Stock

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Northwest PG Solutions

USA . 1,584 parts In-Stock

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$7.202

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1,584

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Overview

Experience the power and efficiency of the Texas Instruments DM388AAAR01 microprocessor. With its cutting-edge technology and integrated cache, this product offers unmatched performance in a compact package. Ideal for a wide range of applications, from embedded systems to IoT devices, this processor delivers high-speed processing and low power consumption. Trust in Texas Instruments' reputation for quality and innovation, and elevate your projects with the DM388AAAR01. Discover the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring long-term reliability.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, making this microprocessor ideal for high-performance applications.

Surface Mount: YES

Being surface mountable makes installation and assembly easier, saving time and effort during production.

Maximum Supply Voltage: 1.26 V

Operating within this range ensures stable performance while preventing damage due to overvoltage.

Address Bus Width: 28

Having a wider address bus allows for efficient data transfer and access, improving overall system performance.

Package Shape: SQUARE

The square shape of the package allows for better space utilization and easy integration into various electronic devices.

Bit Size: 32

A 32-bit architecture enables processing of larger data sets and faster computation, making this microprocessor suitable for complex tasks.

No. of Terminals: 609

The high number of terminals allows for a greater level of connectivity and compatibility with different components in a system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This style of packaging offers a compact design with a high terminal count, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.14 V

Operating within this range ensures stable performance while preventing damage due to undervoltage.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance, enhancing the longevity and reliability of the microprocessor.

Terminal Position: BOTTOM

Bottom terminal position allows for easy mounting on PCBs and simplifies the overall assembly process.

Maximum Seated Height: 1.32 mm

The low profile of the microprocessor enables it to be used in slim devices without compromising on performance.

Width: 16 mm

Compact width makes the microprocessor suitable for applications where space is limited.

Boundary Scan: YES

Boundary scan capability allows for easy testing and debugging of the microprocessor, ensuring reliability and performance.

External Data Bus Width: 16

Having a wide external data bus facilitates faster data transfer between the microprocessor and other components, enhancing overall system speed.

Maximum Clock Frequency: 30 MHz

High clock frequency enables rapid processing of instructions, making this microprocessor ideal for tasks that require quick computations.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the microprocessor can withstand high temperatures during the manufacturing process without being damaged.

Peak Reflow Temperature °C: 260

The microprocessor can endure high reflow temperatures without compromising its functionality or reliability.

Length: 16 mm

Compact length makes the microprocessor suitable for applications with space constraints.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture offers high performance and efficient processing, making this microprocessor suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the microprocessor energy-efficient and fast.

Terminal Form: BALL

Ball terminal form provides secure connections and simplifies the soldering process during assembly.

Nominal Supply Voltage: 1.2 V

Operating at a nominal voltage ensures stable performance and energy efficiency, making the microprocessor suitable for various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high density packaging and facilitates miniaturization in electronic devices.

Format: FLOATING POINT

Floating point format enables the microprocessor to handle complex mathematical calculations with precision and speed.

Moisture Sensitivity Level (MSL): 3

MSL 3 allows for safe exposure to ambient moisture levels during storage and assembly processes, ensuring reliability.

Speed: 720 rpm

High operating speed enables rapid data processing and computation, making the microprocessor suitable for real-time applications.

Low Power Mode: YES

Having a low power mode option allows for energy efficiency and prolonged battery life in portable devices.

Technical Specifications

Microprocessors DM388AAAR01 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

609

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.32 mm

Speed:

720 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM388AAAR01 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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