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DM385AAAR21

Texas Instruments

DM385AAAR21 by Texas Instruments

The Texas Instruments DM385AAAR21 microprocessor features a 32-bit architecture with 28-bit address bus width and integrated cache. Operating at up to 30 MHz, it offers low power mode and boundary scan capabilities. Ideal for applications requiring high-speed processing in compact devices with stringent power requirements.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,831 parts In-Stock

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Digiode

USA . 2,569 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 82 parts In-Stock

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Bristol Electronics

USA . 82 parts In-Stock

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Dan-Mar Components

USA . 82 parts In-Stock

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Native Components

USA . 361 parts In-Stock

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$0.523

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361

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Northwest PG Solutions

USA . 2,233 parts In-Stock

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$0.575

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One Stop Electronics

USA . 1,398 parts In-Stock

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$13.000

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AZTECH Wire

Italy . 895 parts In-Stock

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$13.104

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Microchip USA

USA . 1,648 parts In-Stock

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$28.390

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$27.990

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$27.780

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$27.580

1,648

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$27.580

Parana Technologies

USA . 2,140 parts In-Stock

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$49.391

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DigiPath Technology Company

USA . 803 parts In-Stock

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$54.385

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$50.034

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ChromeModa Solutions

Germany . 4,356 parts In-Stock

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$55.495

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$45.506

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IDEA Electronic Components Group

UK . 70 parts In-Stock

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$55.495

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$52.720

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$49.946

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70

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$49.946

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A-Z Elektronik GmbH

Germany . 5,123 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,415 parts In-Stock

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Corphita

USA . 2,853 parts In-Stock

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Component Stockers USA

USA . 2,493 parts In-Stock

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Kepictronics

USA . 694 parts In-Stock

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Overview

Experience unmatched performance and reliability with the Texas Instruments DM385AAAR21 microprocessor. Crafted by a renowned manufacturer, this cutting-edge chip is designed to optimize efficiency and power in a variety of applications. With integrated cache and advanced technology, this microprocessor delivers superior speed and processing capabilities. From seamless multitasking to lightning-fast data transfers, the DM385AAAR21 offers unparalleled value and benefits for customers looking to elevate their electronic devices. Upgrade to the next level of performance with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Integrated Cache: YES

Having integrated cache helps in improving the overall speed and performance of the microprocessor by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.42 V

High maximum supply voltage ensures stable operation even under heavy workloads or in demanding conditions.

Address Bus Width: 28

Having a wide address bus width allows for efficient communication between different components in the system, enhancing overall efficiency.

Bit Size: 32

A 32-bit architecture allows the microprocessor to handle larger chunks of data at once, improving processing speed and capabilities.

Width: 16 mm

Compact width makes the microprocessor suitable for small form factor devices without compromising on performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Maximum Clock Frequency: 30 MHz

High clock frequency allows for faster data processing and execution of instructions, enhancing overall performance.

Technical Specifications

Microprocessors DM385AAAR21 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

609

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA609,31X31,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.14/1.42

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.32 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM385AAAR21 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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